Nanchang Hangkong University — China
Engineering · Physical Sciences
19h-index1.4kcitations66works33.52yr avg
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Research Topics
Electronic Packaging and Soldering Technologies(16), 3D IC and TSV technologies(12), Epoxy Resin Curing Processes(11), Advanced Photocatalysis Techniques(9), Metal and Thin Film Mechanics(7)
Publications66 total
Advanced Functional Materials·2024· 67 citedOpen Access
Frontiers in artificial intelligence and applications·2023· 2 citedOpen Access
AHFE international·2023· 1 cited
Chemical Engineering Journal·2022· 20 cited
Inorganica Chimica Acta·2022· 1 cited
International Journal of Plant Animal and Environmental Sciences·2022· 1 citedOpen Access
Sustainable Energy & Fuels·2021· 2 citedOpen Access
Sustainable Energy & Fuels·2021· 35 cited
Journal of Colloid and Interface Science·2020· 103 cited
Journal of Materials Chemistry A·2020· 79 cited
Sustainable Energy & Fuels·2019· 79 cited
WORLD SCIENTIFIC eBooks·2019
ACS Sustainable Chemistry & Engineering·2019· 13 cited
ACS Applied Materials & Interfaces·2019· 165 cited
RSC Advances·2017· 94 citedOpen Access
Applied Catalysis B: Environmental·2014· 120 cited
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Frequent Co-authors
C.P. Wong(21), Min Luo(9), Xiaoman Li(8), Wanguo Gao(6), Xu Zhang(5), Ivan L. Berry(5), Rong Huang(4), Senda Su(4), R.C. Dunne(4), Bao Pan(3), Wenyue Su(3), Xuxu Wang(3), Tom Jiang(3), Suresh K. Sitaraman(3), William E. Estes(3), M. Periyasamy(3), Carlo Waldfried(3), Dwight Roh(3), James DeLuca(3), Orlando Escorcia(3)