Carl Zweben

Materials Science · Physical Sciences

17h-index1.7kcitations50works0.02yr avg
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Research Topics

Material Properties and Applications(12), Mechanical Behavior of Composites(11), Electronic Packaging and Soldering Technologies(10), 3D IC and TSV technologies(8), Additive Manufacturing and 3D Printing Technologies(6)

Publications50 total

4.16 Metal Matrix Composite Thermal Management Materials
Elsevier eBooks·2017· 2 cited
3.23 Polymer Matrix Composite Thermal Materials
Elsevier eBooks·2017· 2 cited
Summary and concluding remarks
Philosophical Transactions of the Royal Society A Mathematical Physical and Engineering Sciences·2016· 3 cited
Composite Materials
Mechanical Engineers' Handbook·2015· 26 citedOpen Access
Advanced composite materials for optomechanical systems
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2013· 5 cited
Advanced thermal management materials for concentrator photovoltaic arrays
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2010· 3 cited
1. Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration
2009
Ceramic Matrix Composites—Mechanical Properties and Test Methods
Ceramic engineering and science proceedings·2008· 16 cited
Advances in photonics thermal management and packaging materials
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2008· 12 cited
Advances in LED packaging and thermal management materials
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2008· 26 cited
Advances in high-performance thermal management materials : A review
Journal of advanced materials·2007· 71 cited
Recent advances in photonics packaging materials
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2006· 1 cited
Composite Materials
Mechanical Engineers' Handbook·2005· 5 cited
New low-CTE ultrahigh-thermal-conductivity materials for lidar laser diode packaging
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2005· 5 cited
Emerging low-cost LED thermal management materials
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2004· 14 cited
New material options for light-emitting diode packaging
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2004· 10 cited
New material options for high-power diode laser packaging
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2004· 11 cited
Thermal Management and Control of Electromagnetic Emissions
Emerging technology in advanced packaging series·2003
Composite Materials
2002· 4 cited
Thermal Management and Electronic Packaging Applications
Composites·2001· 19 cited
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Frequent Co-authors

Anthony Kelly(4), S. V. Kulkarni(3), Tsu-Wei Chou(2), Leif A. Carlsson(2), Robert L. Crane(2), Kenji Uchino(2), Eddy A. Derby(2), Colin G. Gordon(2), Daniel Vukobratovich(2), Paul R. Yoder(2), Anthony Kelly(2), D.D.L. Chung(1), H. Thomas Hahn(1), Anthony E. Kelly(1), T.W. Clyne(1), Piping Division(1), Arthur V. Cooke(1), Natarajan Shankar(1), Lorianne Jones(1), Dave Ewaldz(1)