K. N. Subramanian

Wellesley College — United States

Engineering · Physical Sciences

42h-index5.8kcitations200works1.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(67), 3D IC and TSV technologies(36), Aluminum Alloys Composites Properties(33), Bacteriophages and microbial interactions(28), Advanced ceramic materials synthesis(25)

Publications200 total

Thermo-mechanical behavior of three-phase shape memory polymers for a wide temperature change
Mechanics of Materials·2025· 1 cited
Effect of Isometric Exercises (Quadriceps Strengthening) in Patients with Osteoarthritis Knee
Journal of Orthopedics and Joint Surgery·2023· 2 citedOpen Access
Evaluation of Wear Behaviour for Al/B4C/Fly Ash Composites by Stir Casting Process
2018· 6 cited
Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages
Microelectronics Reliability·2017· 28 cited
Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders
Journal of Alloys and Compounds·2015· 24 cited
An Empirical Relationship between Modulus of Elasticity, Modulus of Rupture and Compressive Strength of M60 Concrete Containing Metakaolin
Research Journal of Applied Sciences Engineering and Technology·2014· 12 citedOpen Access
Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints
Journal of Electronic Materials·2014· 20 cited
Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders
Journal of Electronic Materials·2013· 9 cited
Get Involved: K.N. Subramanian—Organizer, Collaborator, Mentor
JOM·2013Open Access
Critical studies to improve service reliability of Sn–Ag–Cu solder joints by thermal treatments
Journal of Materials Science Materials in Electronics·2012· 5 cited
Index
2012
Front Matter
2012
Reliability of Lead‐Free Electronic Solder Interconnects: Roles of Material and Service Parameters
2012· 3 cited
Effect of Temperature‐Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn‐Ag Solder Joints
2012· 1 cited
Study of Joule heating effects in lead-free solder joints under Electromigration
2011· 1 cited
Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane
Journal of Electronic Materials·2010· 40 cited
Foreword
Journal of Electronic Materials·2009· 1 citedOpen Access
Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints
Journal of Electronic Materials·2009· 7 cited
Effect of strain on whisker growth in matte tin
Soldering and Surface Mount Technology·2008· 6 cited
Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints
Journal of materials research/Pratt's guide to venture capital sources·2007· 12 cited
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Frequent Co-authors

J. P. Lucas(19), Thomas R. Bieler(16), S. Choi(12), Fei Guo(7), Ravi Dhar(6), J. Pan(6), Jin Gyun Lee(6), S Weissman(5), S W Hartzell(3), Barry J. Byrne(3), Fu Guo(3), S M Weissman(3), Hongjoo Rhee(3), B.Sayeeda Zain(2), Derk J. Bergsma(2), Jessica Lee(2), Thomas Shenk(2), S Zain(2), André Lee(2), George J. Sorger(2)