Navin Srivastava

Materials Science · Physical Sciences

11h-index1.1kcitations25works0.02yr avg
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Research Topics

Carbon Nanotubes in Composites(7), 3D IC and TSV technologies(7), Graphene research and applications(6), Parallel Computing and Optimization Techniques(5), Low-power high-performance VLSI design(5)

Publications25 total

STUDY OF OFDM IMPLEMENTATION ON FPGA
2014
Application of machine learning to wireless sensor networks
Shodhgangotri·2012
Application of machine learning (reinforcement learning) for routing in Wireless Sensor Networks (WSNs)
2012· 11 cited
Carbon Nanotube Vias: Does Ballistic Electron–Phonon Transport Imply Improved Performance and Reliability?
IEEE Transactions on Electron Devices·2011· 33 cited
An efficient 3D Green's function approach for fast impedance extraction of interconnects and spiral inductors in CMOS RF/Millimeter-wavelength circuits
2010
Corrections to “Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate” [Jul 09 1047-1060
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems·2010· 2 cited
Efficient 3D high-frequency impedance extraction for general interconnects and inductors above a layered substrate
2010· 3 cited
Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects
IEEE Transactions on Electron Devices·2009· 435 cited
Current Status and Future Perspectives of Carbon Nanotube Interconnects
2008· 54 cited
High-frequency mutual impedance extraction of VLSI interconnects in the presence of a multi-layer conducting substrate
2008· 3 cited
High-Frequency Mutual Impedance Extraction of VLSI Interconnects In the Presence of a Multi-layer Conducting Substrate
2008 Design, Automation and Test in Europe·2008· 2 cited
Carbon Nanotube Vias: A Reality Check
2007· 17 cited
3D Integration for Introspection
IEEE Micro·2007· 4 cited
Introspective 3D chips
2006· 51 cited
Introspective 3D chips
ACM SIGPLAN Notices·2006
Introspective 3D chips
ACM SIGOPS Operating Systems Review·2006· 4 cited
Introspective 3D chips
ACM SIGARCH Computer Architecture News·2006· 2 cited
Can Carbon Nanotubes Extend the Lifetime of On-Chip Electrical Interconnections?
2006· 9 cited
Modeling and Extraction of Nanometer Scale Interconnects: Challenges and Opportunities (Invited)
2006· 3 cited
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
2006· 198 cited
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Frequent Co-authors

Kaustav Banerjee(22), Sheng‐Chih Lin(7), Banit Agrawal(6), Timothy Sherwood(6), Roberto Suaya(6), Shashidhar Mysore(5), Hong Li(4), Chuan Xu(2), Junfa Mao(2), Wen‐Yan Yin(2), Sungjun Im(2), Gian Luca Loi(1), Kaveri Kadam(1), Rafael Escovar(1), Salvador Ortíz Serrano(1), Murtuza Jeeranwala(1)