Krzysztof Niewęgłowski

Technische Universität Dresden — Germany

Engineering · Physical Sciences

9h-index319citations84works0.42yr avg
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Research Topics

Semiconductor Lasers and Optical Devices(44), Photonic and Optical Devices(40), Nanofabrication and Lithography Techniques(14), Advanced Sensor and Energy Harvesting Materials(12), 3D IC and TSV technologies(12)

Publications82 total

Electronics for the Tactile Internet
Elsevier eBooks·2026
Integration Technology Development of Chip-Antenna Interface for Short Range mmWave Wireless Communication
2025
Silicon nitride-based integrated photonic platform for applications in trustworthy communication systems
2025
A Study on Stretchable Electrical Contacting Techniques for Embedded Chiplet Components
2025
Development of a Capacitive Measurement Setup for a Non-Contact Control System
2025
International Collaborative Hands-on Activities on Advanced Electronics and Photonics for Higher Education Using 3D Printing Techniques
2025
Performance Assessment of Commercial MOX Sensors in Elevated Hydrogen and Methane Concentrations
2025
Design of an Antenna-In-Package for 180 GHz Chip-To-Chip Communication
2025· 1 cited
INTEGRATING 3D PRINTING INTO HIGHER EDUCATION CURRICULA FOR ELECTRONICS: CHALLENGES AND OPPORTUNITIES
ICERI proceedings·2024· 2 cited
Microprinting process development enabling cost effective, high density and flexible electro-optical integration
2024
Evaluation of semipermeable membranes for encapsulating gas sensors in human intestinal environments
2024
Characterization of Embedded and Thinned RF Chips
IMAPSource Proceedings·2024Open Access
Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and Coupling
IMAPSource Proceedings·2024Open Access
Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link
IMAPSource Proceedings·2024Open Access
Stereolithographic Process for Embedding of Electronic Components into Multi-material Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching
IMAPSource Proceedings·2024Open Access
Stereolithographic Process for Embedding of Electronic Components into Multimaterial Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching
Journal of Microelectronics and Electronic Packaging·2024· 3 citedOpen Access
Field-effect transistor CO2 detector based on few layers of black phosphorus
2023
Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical Link
2023· 1 cited
Characterization of Embedded and Thinned RF Chips
2023· 2 cited
Effects of Silanated Glass Particles as Photo Resin Filler to Embed Electronic Components
2023· 3 cited
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Frequent Co-authors

Karlheinz Bock(35), Lukas Lorenz(16), Klaus‐Jürgen Wolter(16), Frank Ellinger(8), Tobias Tiedje(8), Ralf Rieske(8), Sebastian Lüngen(7), Dirk Plettemeier(6), Jörg Franke(6), Karsten Meier(5), Thomas Reitberger(4), K.-J. Wolter(4), Zaid Al-Husseini(3), Niels Neumann(3), Ronny Henker(3), Jens Wagner(3), Gerd-Albert Hoffmann(3), Ludger Overmeyer(3), David Fritsche(2), Corrado Carta(2)