Tomonori Iizuka

Waseda University — Japan

Materials Science · Physical Sciences

13h-index1.1kcitations51works0.02yr avg
OpenAlex↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

High voltage insulation and dielectric phenomena(22), Electronic Packaging and Soldering Technologies(20), 3D IC and TSV technologies(17), Dielectric materials and actuators(14), Aluminum Alloys Composites Properties(11)

Publications51 total

New Interconnection Technologies Based on Ni Micro-plating Bonding for High-temperature Resistant Power Device Packaging
IMAPSource Proceedings·2025Open Access
Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form
Welding International·2023· 2 cited
A new method of joining stainless steels using Ni micro-plating bonding and the mechanical properties of the joint
Welding International·2023· 1 cited
New interconnection technologies based on Ni nano-particle and Ni micro-plating bonding with stress relaxation effect for high-temperature resistant power device packaging
2023· 1 cited
Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY·2023· 1 citedOpen Access
High-temperature resistant interconnection using Ni nanoparticles and Al microparticles paste sintered in an atmosphere
Japanese Journal of Applied Physics·2022· 2 cited
Improvement in the reliability of crystalline silicon solar cell interconnection by using Nickel Micro-Plating Bonding (NMPB) technology
Japanese Journal of Applied Physics·2022· 1 cited
A New Method of Joining Stainless Steels Using Ni micro-plating Bonding Method and Investigation of Mechanical Properties
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY·2022· 1 citedOpen Access
Long-term Reliability of Nickel Micro-Plating Bonding by Using Resonant Type Fatigue Testing Machine
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY·2022· 2 citedOpen Access
High-temperature Resistant Interconnections Formed by Ni Nanoparticles/Al Micro-particles Composite Paste for SiC Power Device Application
Transactions of The Japan Institute of Electronics Packaging·2022· 7 citedOpen Access
Filler‐dependent changes in thermal, dielectric, and mechanical properties of epoxy resin nanocomposites
IEEJ Transactions on Electrical and Electronic Engineering·2020· 9 cited
Fabrication and PD-initiated Breakdown of Simulated Mica Tape Insulation Containing Epoxy Nanocomposites
2020
Electroluminescence of Epoxy Resin Nanocomposite under AC High Field II
2020· 1 cited
Analysis of Discharge Erosion Processes in Epoxy Silica Nanocomposite
2020· 2 cited
An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead and Electrodes
2020· 1 cited
Electrical characteristics of double-sided cooling SiC power module using Ni micro plating bonding
2020
Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
IEEJ Transactions on Industry Applications·2019· 3 cited
Electroluminescence of Epoxy Resin Nanocomposite Under AC High Field
2019· 5 cited
High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding
2019· 14 cited
Development and evaluation of SiC inverter using Ni micro plating bonding power module
2019· 1 cited
page 1 of 3Next →

Frequent Co-authors

Kohei Tatsumi(33), Toshikatsu Tanaka(19), Keiko Koshiba(11), Masahiro Kozako(8), Isamu Morisako(8), Yoshimichi Ohki(7), Yasunori Tanaka(7), Nobuaki Sato(6), Kōji Shimizu(6), Kazutoshi Ueda(6), Masayuki Hikita(6), Kazuhiko Sugiura(6), Kazuhiro Tsuruta(6), Masakazu Inagaki(5), Akihiro Imakiire(5), Keiji Toda(5), Norihiro Murakawa(5), Takahiro Umemoto(5), Hirotaka Muto(5), Zengbin Wang(4)