D. B. Shao

Southeast University — China

Materials Science · Physical Sciences

8h-index333citations13works7.02yr avg
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Research Topics

Optical Coatings and Gratings(3), Nanofabrication and Lithography Techniques(3), Plasmonic and Surface Plasmon Research(2), Electronic Packaging and Soldering Technologies(2), Gas Sensing Nanomaterials and Sensors(2)

Publications13 total

Effect of Microgroove Structure on the Performance of QTFs Utilized for Gas Sensing
IEEE Transactions on Instrumentation and Measurement·2025· 1 cited
Ratiometric Fluorescent Carbon Dots for Detection and Degradation of Partially Hydrolyzed Polyacrylamide
Chinese Journal of Luminescence·2025Open Access
SERS-Based Local Field Enhancement in Biosensing Applications
Molecules·2024· 22 citedOpen Access
Improved T-shaped quartz tuning fork with isosceles-trapezoidal grooves optimized for quartz-enhanced photoacoustic spectroscopy
Photoacoustics·2024· 10 citedOpen Access
Numerical Study on Composite Multilayer Insulation Material for Liquid Hydrogen Storage
Coatings·2024· 9 citedOpen Access
Improved T-Shaped Quartz Tuning Fork with Isosceles-Trapezoidal Grooves Optimized for Quartz-Enhanced Photoacoustic Spectroscopy
SSRN Electronic Journal·2024Open Access
Direct Patterning of Three-Dimensional Periodic Nanostructures by Surface-Plasmon-Assisted Nanolithography
Nano Letters·2006· 53 cited
Surface-plasmon-assisted nanoscale photolithography by polarized light
Applied Physics Letters·2005· 151 cited
Numerical simulation of surface-plasmon-assisted nanolithography
Optics Express·2005· 46 citedOpen Access
Near-field-enhanced, mold-assisted, parallel direct nanostructuring of a gold thin film on glass
Applied Physics Letters·2004· 8 cited
Laser-assisted photothermal imprinting of nanocomposite
Applied Physics Letters·2004· 9 cited
Localized Laser Transmission Bonding for Microsystem Fabrication and Packaging
Journal of Manufacturing Processes·2004· 23 cited
Experimental Investigation and Numerical Simulation of Glass-Silicon Bonding by Localized Laser Heating
Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology·2003· 1 cited

Frequent Co-authors

S. C. Chen(3), Feihu Fang(3), Shengshou Lin(3), Yufei Ma(3), Senthil Theppakuttai(2), Runqiu Wang(2), Yì Wáng(2), Yilü Tao(2), Jinxing Liang(2), S. C. Chen(1), S.C. Chen(1), Yangdong Xie(1), Jie Xu(1), Yuxin Liu(1), Xianlin Qu(1), Songtao Hu(1), Biao Dong(1), Jinxing Liang(1), Yi Lu(1), S. C. Chen(1)