Fei Zong

Engineering · Physical Sciences

4h-index19citations6works0.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(6), 3D IC and TSV technologies(4), Integrated Circuits and Semiconductor Failure Analysis(3), Advanced Surface Polishing Techniques(2), Electrostatic Discharge in Electronics(1)

Publications6 total

Effects of bare cu wires' mechanical properties on ball bond profile
2015
Study on bond pad damage issue in bare Cu wire bonding on SMOS8MV wafer technology
2015· 4 cited
Wafer damage issue study by heavy Al wire wedge bonding
Microelectronics International·2014· 5 cited
Effects of alternating thermal stress on delamination between die attach and leadframe in SOIC package
2013· 4 cited
Tin contamination in PQFN package and its effects on wire bondability
Microelectronics International·2013· 6 cited
A new package structure with power stacked-die multi-row lead and process flow
2011

Frequent Co-authors

Jiyong Niu(3), Yanbo Xu(2), Zhijie Wang(2), Naikuo Zhou(2), Zhi‐jie Wang(1), Han‐min Zhang(1), Hanmin Zhang(1), Ming Hu(1), Baoguan Yin(1), Denghong Ye(1), Qingchun He(1), Zhijie Wang(1), Yanbo Xu(1), Yi Che(1), Zhimei Sun(1), Shunan Qiu(1), Tian Yong Jiang(1)