Mark Paffett

Materials Science · Physical Sciences

8h-index1.1kcitations19works0.02yr avg
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Research Topics

Copper Interconnects and Reliability(7), Molecular Junctions and Nanostructures(5), Nuclear Materials and Properties(4), Organometallic Complex Synthesis and Catalysis(2), Catalytic Processes in Materials Science(2)

Publications19 total

On-line enrichment monitor for UF6 GCEP
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)·2011· 1 citedOpen Access
The Influence of Impurities in Alpha-Uranium on Hydrogen Reaction Kinetics Using in Situ EC-STM
ECS Meeting Abstracts·2006Open Access
Laser acceleration of quasi-monoenergetic MeV ion beams
Nature·2006· 685 cited
Gas Generation from Actinide Oxide Materials
2000· 7 citedOpen Access
THE SCIENTIFIC BASIS FOR PLUTONIUM STABILIZATION WITH PARTICULAR EMPHASIS ON GAS GENERATION
2000· 1 cited
Fundamental experimental determinations of thermal and radiolytic gas generation over actinide oxides
Transactions of the American Nuclear Society·1999
Surface Modifications of Superabrasive Crystals for Improved Bond Applications - Summary of TTI Crada Results
1997Open Access
Hot-wall chemical vapor deposition of copper from copper(I) compounds. 2. Selective, low-temperature deposition of copper from copper(I) .beta.-diketonate compounds, (.beta.-diketonate)CuLn, via thermally induced disproportionation reactions
Chemistry of Materials·1992· 73 cited
ChemInform Abstract: Chemical Vapor Deposition of Copper from (Hexafluoroacetylacetonato)( alkyne)copper(I) Complexes via Disproportionation.
ChemInform·1992
Chemical vapor deposition of copper via disproportionation of hexafluoroacetylacetonato(1,5 -cyclooctadiene)copper(I), (hfac)Cu(1,5-COD)
Journal of materials research/Pratt's guide to venture capital sources·1992· 53 cited
New Approaches for Dry Etching Metal Oxides at low Temperature and High Rates
MRS Proceedings·1992· 7 cited
Chemical vapor deposition of copper from (hexafluoroacetylacetonato)(alkyne)copper(I) complexes via disproportionation
Chemistry of Materials·1991· 103 cited
ChemInform Abstract: Selective Low‐Temperature Chemical Vapor Deposition of Copper from ( Hexafluoroacetylacetonato)copper(I)trimethylphosphine, (hfa)CuP(Me)3
ChemInform·1991
Selective low‐temperature chemical vapor deposition of copper from (hexafluoroacetylacetonato)copper(I)trimethylphosphine, (hfa)CuP(Me)<sub>3</sub>
Advanced Materials·1991· 48 cited
Chemical vapor deposition of copper from copper(I) trimethylphosphine compounds
Chemistry of Materials·1990· 66 cited
Chemical Vapor Deposition of Copper From Metal-Organic Copper(I) Phosphine Complexes
MRS Proceedings·1990· 2 cited
Platinum loss and migration in porous gas diffusion fuel cell electrodes as studied by Rutherford backscattering spectrometry
Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms·1987· 8 citedOpen Access
On the Anodic Oxidation of Formaldehyde during the Electroless Copper Plating Process
Journal of The Electrochemical Society·1986· 24 cited
The role of chlorine promoters in catalytic ethylene epoxidation over the Ag(110) surface
Applied Surface Science·1984· 5 cited

Frequent Co-authors

Toivo T. Kodas(9), Mark J. Hampden‐Smith(9), J.D. Farr(8), Hyung Kyu Shin(5), Kai‐Ming Chi(4), A. Jain(2), K. M.(2), J. G. Beery(2), John L. Lyman(2), Ajay K. Jain(2), B. M. Hegelich(1), B. J. Albright(1), J. A. Cobble(1), Kirk Flippo(1), S. Letzring(1), H. Rühl(1), J. Schreiber(1), R. Schulze(1), J. C. Fernández(1), S. Gottesfeld(1)