S. Wane

DBV Technologies (France) — France

Engineering · Physical Sciences

7h-index225citations58works1.32yr avg
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Research Topics

Microwave Engineering and Waveguides(19), Electromagnetic Compatibility and Noise Suppression(19), Radio Frequency Integrated Circuit Design(15), Electromagnetic Compatibility and Measurements(9), Microwave and Dielectric Measurement Techniques(8)

Publications58 total

Digital-Twin Solutions for IC-Package-PCB-Antenna Systems: Correlation-Aware Equivalent Circuit Representation Using Eigen-State Formulation
2025
AI-Powered Physics-Informed Correlation Technologies for Advanced Thermal-Imaging in Near and Far Fields
2025· 1 cited
Flexible Substrates toward Deformable, Stretchable and Deployable Smart-Skins Integrating Energy-Efficient Active-Antennas Using Correlation Technologies
2025
Digital-Twin Technology Solutions for Chip-Package-PCB-Antenna Systems
2025· 2 cited
Analysis of Back-Gate Bias Control on EVM Measurements of a Dual-Band Power Amplifier in 22 nm FD-SOI for 5G 28 and 39 GHz Applications
IEEE Transactions on Circuits and Systems I Regular Papers·2024· 4 citedOpen Access
Phased Array Combined with 3D-Printed Dielectric Lens for Millimeter Wave Fixed Wireless Access
2024Open Access
A Low-Power 42 to 67 GHz Variable-Gain LNA in 22FDX® on Standard- and High-Resistivity Substrates with 3.4 dB Noise Figure
2024· 1 citedOpen Access
Multi-Beamforming Using Metasurface-Antenna Co-Designed with Energy-Efficient Adaptive Electronics
2024· 3 cited
EM-Thermal Correlation Technologies for Industrial-Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules
2024· 1 cited
Scalable Modular Beamformers for Energy-Efficient MIMO Applications Using Correlation Technologies
2023· 2 cited
Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis
2023· 6 cited
Spintronics Technology Solutions for Interferometric Thermal-Electromagnetic Sensing
2022
Correlation Technologies for OTA Testing of mmWave Mobile Devices Using Energy Metrics
2022· 2 cited
High Resolution Spintronics Probe-Array Technology Solutions for Very Near-Field Scanning
2021· 3 cited
Smart Sensing of Vital-Signs: Co-Design of Tunable Quantum-Spin Crossover Materials with Secure Photonics and RF Front-End-Module
2021· 5 cited
Broadband Smart mmWave Front-End-Modules in Advanced FD-SOI with Adaptive-Biasing and Tuning of Distributed Antenna-Arrays
2020· 6 cited
mmWave Dual-Beam Phased-Arrays including Down-Conversion with Smart Data Fusion for Autonomous Driving
2020· 1 cited
Toward Co-Design of Spin-Wave Sensors with RFIC Building Blocks for Emerging Technologies
2018 2nd URSI Atlantic Radio Science Meeting (AT-RASC)·2018· 4 citedOpen Access
Energy Spectrum Sensing using Two-Antenna Probes based on the Measurement of Field-Field Auto-Correlation and Cross-Correlation Functions
2017
Toward Standard Near-Field Measurement Solutions for Stochastic Electromagnetic Fields
2017· 1 cited
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Frequent Co-authors

Damienne Bajon(29), H. Baudrand(12), P. Gamand(11), Thanh Vinh Dinh(8), Johannes A. Russer(7), P. Russer(7), D. Bajon(7), Tran Quang Hung(6), Azzedine Bousseksou(6), Laurent Leyssenne(5), V. Huard(5), Martin Rack(5), Lucas Nyssens(5), J.‐P. Raskin(5), A. E. Cabrera(5), J. Sombrin(5), Farooq Mukhtar(4), Olivier Tesson(4), Dominique Lesénéchal(4), Philippe Descamps(4)