T. Ozaki

Toshiba (Japan) — Japan

Materials Science · Physical Sciences

16h-index987citations45works0.02yr avg
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Research Topics

High voltage insulation and dielectric phenomena(16), Semiconductor materials and devices(15), Ferroelectric and Negative Capacitance Devices(13), Advancements in Semiconductor Devices and Circuit Design(9), Dielectric materials and actuators(9)

Publications45 total

Optimum design of wave absorbers using foamed polyimide containing carbon black based on genetic algorithm
2011· 2 cited
A Scalable Shield-Bitline-Overdrive Technique for Sub-1.5 V Chain FeRAMs
IEEE Journal of Solid-State Circuits·2011· 2 cited
A 100 MHz Ladder FeRAM Design With Capacitance-Coupled-Bitline (CCB) Cell
IEEE Journal of Solid-State Circuits·2011· 19 cited
A 100MHz ladder FeRAM design with capacitance-coupled-bitline (CCB) cell
2010· 7 cited
A scalable shield-bitline-overdrive technique for 1.3V Chain FeRAM
2010· 14 cited
A 1.6 GB/s DDR2 128 Mb Chain FeRAM With Scalable Octal Bitline and Sensing Schemes
IEEE Journal of Solid-State Circuits·2010· 75 cited
A 64-Mb Chain FeRAM With Quad BL Architecture and 200 MB/s Burst Mode
IEEE Transactions on Very Large Scale Integration (VLSI) Systems·2009· 20 cited
Improving Epoxy-based Insulating Materials with Nano-fillers toward Practical Application
2008· 51 cited
A novel characterization method to monitor process damage for transistors
2008
Molecular dynamics simulation of characteristics of polymer matrices in nanocomposites
2007· 5 cited
High-density and high-speed 128Mb chain FeRAM™ with SDRAM-compatible DDR2 interface
Symposium on VLSI Technology·2006· 11 cited
Influence of temperature on mechanical and insulation properties of epoxy-layered silicate nanocomposite
IEEE Transactions on Dielectrics and Electrical Insulation·2006· 110 cited
Effects of nano- and micro-filler mixture on electrical insulation properties of epoxy based composites
IEEE Transactions on Dielectrics and Electrical Insulation·2006· 233 cited
A SrRuO3/IrO2 top electrode FeRAM with Cu BEOL process for embedded memory of 130nm generation and beyond
Solid-State Electronics·2006· 21 cited
Surface erosion due to partial discharges on several kinds of epoxy nanocomposites
2005· 48 cited
Insulation properties of nano- and micro-filler mixture composite
2005· 33 cited
A new fabrication technology of FinFETs using a neutral beam etching
2005
Surface roughness change of epoxy/TiO/sub 2/ nanocomposites due to partial discharges
2005· 33 cited
Evaluation of insulation properties of epoxy resin with nano-scale silica particles
2005· 32 cited
Preparation and insulation properties of epoxy-layered silicate nanocomposite
2004· 44 cited
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Frequent Co-authors

A. Nitayama(11), D. Takashima(10), Toshio Shimizu(9), Toshikatsu Tanaka(8), I. Kunishima(8), Fumio Sawa(7), Tsuyoshi Imai(7), S. Shiratake(7), S. Shuto(7), K. Yamakawa(7), Masahiro Kozako(6), T. Hamamoto(6), H. Shiga(5), Y. Kumura(5), Shuhei Nakamura(5), Jiro Kawai(5), Katsuhiko Hoya(4), Tadashi Miyakawa(4), Ryu Ogiwara(4), Sumiko Doumae(4)