Yohei Sugawara

Preferred Networks (Japan) — Japan

Engineering · Physical Sciences

11h-index622citations56works0.42yr avg
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Research Topics

Semiconductor materials and devices(14), 3D IC and TSV technologies(11), Copper Interconnects and Reliability(6), Advancements in Semiconductor Devices and Circuit Design(5), Integrated Circuits and Semiconductor Failure Analysis(5)

Publications56 total

Development of an AI-based magnetic resonance imaging reading support program (AMP) for deep endometriosis diagnosis
Scientific Reports·2025Open Access
Creating a general-purpose generative model for healthcare data based on multiple clinical studies
PLOS Digital Health·2025Open Access
Creating a General-Purpose Generative Model for Healthcare Data based on Multiple Clinical Studies
2025· 1 citedOpen Access
Anatomical 3D Style Transfer Enabling Efficient Federated Learning with Extremely Low Communication Costs
arXiv (Cornell University)·2024Open Access
Clinical outcomes during and after wearable cardioverter defibrillator use in Japanese patients with heart failure: A single‐center experience
Journal of Arrhythmia·2024· 1 citedOpen Access
Virtual Human Generative Model: Masked Modeling Approach for Learning Human Characteristics
arXiv (Cornell University)·2023Open Access
Label-Efficient Multi-task Segmentation Using Contrastive Learning
Lecture notes in computer science·2021· 8 cited
Label-Efficient Multi-Task Segmentation using Contrastive Learning
arXiv (Cornell University)·2020Open Access
The Development of a Skin Cancer Classification System for Pigmented Skin Lesions Using Deep Learning
Biomolecules·2020· 249 citedOpen Access
GA-GAN: CT reconstruction from Biplanar DRRs using GAN with Guided Attention
arXiv (Cornell University)·2019· 3 citedOpen Access
Einconv: Exploring Unexplored Tensor Decompositions for Convolutional Neural Networks
arXiv (Cornell University)·2019· 7 citedOpen Access
Einconv: Exploring Unexplored Tensor Network Decompositions for Convolutional Neural Networks
arXiv (Cornell University)·2019· 2 citedOpen Access
BayesGrad: Explaining Predictions of Graph Convolutional Networks
arXiv (Cornell University)·2018· 1 citedOpen Access
Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs
2018· 8 cited
TSV liner dielectric technology with spin-on low-k polymer
2018· 4 cited
BayesGrad: Explaining Predictions of Graph Convolutional Networks
Lecture notes in computer science·2018· 11 cited
Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission
2017· 7 cited
Evaluation of Depth-dependent Interface States at TSV-liner SiO 2 Using Multi-well Structured TSV
The Japan Society of Applied Physics·2016
Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-Induced Retention Time Modulation of DRAM Cell Array
Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials·2015
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC
2015· 3 cited
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Frequent Co-authors

H Usami(8), Shin‐ichi Maeda(7), Hisashi Kino(7), Tetsu Tanaka(6), Takafumi Fukushima(5), Yuichiro Hirano(4), Akihiko Yamamoto(4), Masahiro Nagamuta(4), Seiya Tanikawa(4), H. Hashiguchi(4), Shigeyuki Hamada(3), Toshiko Yamamoto(3), Kimiko Kato(3), Susumu Kokeguchi(3), S Kotani(3), Isamu Asano(3), S. Iijima(3), Kohei Hayashi(3), Mitsumasa Koyanagi(3), R. Furukawa(3)