H. Fujimoto

Intel (United States) — United States

Engineering · Physical Sciences

15h-index806citations52works0.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(15), Copper Interconnects and Reliability(13), Metal and Thin Film Mechanics(12), 3D IC and TSV technologies(11), Semiconductor Lasers and Optical Devices(9)

Publications52 total

Integration Of Polymeric Electrooptic Devices
2005
Local Plasticity of Al Thin Films as Revealed by X-Ray Microdiffraction
Physical Review Letters·2003· 60 cited
Applications of new assembly method 'micron bump bonding method'
2003· 6 cited
A new LSI bonding technology 'micron bump bonding technology'
Proceedings., 39th Electronic Components Conference·2003· 13 cited
New solderless connection technology using light-setting insulation resin
2002
A wafer-level burn-in technology using the contactor controlled thermal expansion
2002· 7 cited
High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction
Applied Physics Letters·2002· 87 citedOpen Access
Moisture diffusion along the TiN/SiO2 interface and in plasma-enhanced chemical vapor deposited SiO2
Journal of Applied Physics·2000· 11 cited
Developing design rules to avert cracking and debonding in integrated circuit structures
Engineering Fracture Mechanics·2000· 29 cited
Thin Film Cracking and Ratcheting Caused by Temperature Cycling
Journal of materials research/Pratt's guide to venture capital sources·2000· 72 cited
[가솔린엔진부문] BULK COMBUSTION을 위한 메탄올 및 가솔린 혼합연료의 분무특성에 관한 연구
한국자동차공학회 춘 추계 학술대회 논문집·2000
<title>Performance of polycrystalline silicon waveguide devices for compact on-chip optical interconnection</title>
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·1999· 9 cited
<title>Micron-sized channel-dropping filters using silicon waveguide devices</title>
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·1999· 17 cited
Mechanical behaviour of submicron multilayers submitted to microtensile experiments
Thin Solid Films·1999· 24 cited
Measurement of Toughness for Sin Films on Silicon Using Channel Cracking Technique
MRS Proceedings·1999· 1 cited
Subcritical Debonding of Multilayer Interconnect Structures: Temperature and Humidity Effects
MRS Proceedings·1999· 15 cited
Kinetics of the Tial<sub>3</sub> Formation From Al/Ti Thin Films
MRS Proceedings·1999· 1 cited
Interfacial Diffusivity of Moisture Along A SiO<sub>2</sub>/Tin Interface Measured Using Imaging Secondary Ion Mass Spectroscopy (SIMS)
MRS Proceedings·1999· 1 cited
Micromechanics-Based Modeling of Interfacial Debonding in Multilayer Structures
MRS Proceedings·1999· 5 cited
Measurement of Thin Film Mechanical Properties by Microbeam Bending
MRS Proceedings·1999· 14 cited
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Frequent Co-authors

Qing Ma(12), T. Marieb(8), Kenzo HATADA(6), Michael Lane(5), Maria Ignat(5), Qing Ma(5), H. A. Padmore(3), Zhigang Suo(3), Takafumi Ochi(3), Qing Ma(3), Reinhold H. Dauskardt(3), Reiner Dauskardt(3), Nety Krishna(3), Guanghai Xu(3), Yoshiyuki Tani(3), Masaru Sasago(3), Frédéric Voiron(3), Nobumichi Tamura(2), Alastair A. MacDowell(2), Richard Celestre(2)