X. Boddaert

Mines Saint-Étienne — France

Engineering · Physical Sciences

11h-index546citations35works4.02yr avg
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Research Topics

Semiconductor materials and devices(9), Advanced Sensor and Energy Harvesting Materials(8), Electronic Packaging and Soldering Technologies(6), Semiconductor materials and interfaces(6), Integrated Circuits and Semiconductor Failure Analysis(6)

Publications35 total

Enhancing Electrical and Mechanical Properties of Conductive Textile for Wearable Embedded Systems Through Copper Electroplating
Advanced Engineering Materials·2024· 4 cited
Textile Electronic Circuits from Laser‐Patterned Conductive Fabric
Advanced Engineering Materials·2023· 17 cited
Toward autonomous wearable triboelectric systems integrated on textiles
iScience·2022· 6 citedOpen Access
Inkjet-Printed Membrane for a Capacitive Acoustic Sensor: Development and Characterization Using Laser Vibrometer
Sensors·2017· 11 citedOpen Access
Inkjet printing of high molecular weight PVDF-TrFE for flexible electronics
Flexible and Printed Electronics·2015· 94 cited
Fabrication of Capacitive Acoustic Resonators Combining 3D Printing and 2D Inkjet Printing Techniques
Sensors·2015· 32 citedOpen Access
Ellipsometry study of process deposition of amorphous Indium Gallium Zinc Oxide sputtered thin films
Thin Solid Films·2015· 9 cited
Optimization of Capacitive Acoustic Resonant Sensor Using Numerical Simulation and Design of Experiment
Sensors·2015· 9 citedOpen Access
RFID tags for cryogenic applications: Experimental and numerical analysis of thermo-mechanical behaviour
Microelectronics Reliability·2013· 7 citedOpen Access
Organic ultrathin film adhesion on compliant substrate using scratch test technique
Thin Solid Films·2012· 14 cited
Ge2Sb2Te5 layer used as solid electrolyte in conductive-bridge memory devices fabricated on flexible substrate
Solid-State Electronics·2012· 29 cited
Characterization of organic ultra-thin film adhesion on flexible substrate using scratch test technique
Surface and Coatings Technology·2011· 20 cited
Reliability of OTFTs on flexible substrate: mechanical stress effect
The European Physical Journal Applied Physics·2011· 29 citedOpen Access
Mechanical and thermal reliability of printed organic thin-film transistor
Microelectronics Reliability·2010· 5 cited
Evaluation of probing process parameters and PAD designs: Experiments and modelling correlations for solving mechanical issues
2010· 2 cited
Effect of Packaging Design on Wire Bond Interconnection Reliability
HAL (Le Centre pour la Communication Scientifique Directe)·2009
Reliability of organic thin-film transistors on plastic film
2009
Mechanical study of the probing effect on PAD structures
HAL (Le Centre pour la Communication Scientifique Directe)·2009
Numerical Investigations of Smart Card Module: Parametric Analysis and Design Optimization
IEEE Transactions on Device and Materials Reliability·2008· 4 cited
Numerical Investigations of Smart Card Module: Parametric Analysis and Design Optimization
IEEE Transactions on Device and Materials Reliability·2008
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Frequent Co-authors

P. Benaben(9), D. Stiévenard(8), J. C. Bourgoin(6), Rubaiyet Iftekharul Haque(4), B. Bensaïd(4), Valentin Gaubert(3), Thierry Djenizian(3), Roger Delattre(3), J.L. Goudard(3), D. Laffitte(3), J. Périnet(3), K. Inal(3), H. J. von Bardeleben(2), Erick Ogam(2), Christophe Loussert(2), R. Coppard(2), G. Covarel(2), P. Berthier(2), Michael Su(2), R. Roucou(2)