Jeffrey Smith

Engineering · Physical Sciences

7h-index454citations18works0.02yr avg
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Research Topics

Semiconductor materials and devices(10), Advancements in Photolithography Techniques(7), Advancements in Semiconductor Devices and Circuit Design(5), 3D IC and TSV technologies(5), Advanced Surface Polishing Techniques(3)

Publications18 total

CFET Design Options, Challenges, and Opportunities for 3D Integration
2021 IEEE International Electron Devices Meeting (IEDM)·2021· 29 cited
Agile Pathfinding Technology Prototyping: the Hunt for Directional Correctness
2020· 1 cited
DTCO acceleration to fight scaling stagnation
2020· 9 cited
Plasma etch selectivity study and material screening for self-aligned gate contact (SAGC)
2019· 4 cited
Enabling complimentary FET (CFET) fabrication: selective, isotropic etch of Group IV semiconductors (Conference Presentation)
2019· 2 cited
Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning
Journal of Micro/Nanolithography MEMS and MOEMS·2018· 7 cited
Perspective: New process technologies required for future devices and scaling
APL Materials·2018· 180 citedOpen Access
Self-aligned blocking integration demonstration for critical sub-30nm pitch Mx level patterning with EUV self-aligned double patterning
2018· 4 cited
Novel patterning schemes and technologies for the sub 5nm era
2018
Thin Film Process Technologies for Continued Scaling
2018· 2 cited
EPE improvement thru self-alignment via multi-color material integration
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2017· 10 cited
Self-aligned blocking integration demonstration for critical sub-40nm pitch Mx level patterning
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2017· 7 cited
Self-aligned block technology: a step toward further scaling
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2017· 6 cited
LER improvement for sub-32nm pitch self-aligned quadruple patterning (SAQP) at back end of line (BEOL)
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2016· 3 cited
Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2015· 17 cited
Directed self-assembly defectivity assessment. Part II
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2012· 67 cited
Self-assembly patterning for sub-15nm half-pitch: a transition from lab to fab
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011· 106 cited
Value of article on tinted contact lenses disputed
Journal of the American Veterinary Medical Association·1986

Frequent Co-authors

Peter Biolsi(8), Akiteru Ko(7), Nihar Mohanty(6), Angélique Raley(6), Richard A. Farrell(6), Andrew Metz(6), Anton Devilliers(5), Kaushik Kumar(4), Subhadeep Kal(4), Xinghua Sun(4), David O’Meara(3), Lars W. Liebmann(3), D. Chanemougame(3), Steven Scheer(3), Robert D. Clark(2), Kandabara Tapily(2), T. Hakamata(2), Steven Consiglio(2), Cory S. Wajda(2), Chris Bencher(2)