Chris Bencher

Applied Materials (United States) — United States

Engineering · Physical Sciences

11h-index551citations31works1.02yr avg
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Research Topics

Advancements in Photolithography Techniques(21), Copper Interconnects and Reliability(8), 3D IC and TSV technologies(7), Integrated Circuits and Semiconductor Failure Analysis(7), Nanofabrication and Lithography Techniques(6)

Publications31 total

Challenges and Innovations in Dual Damascene Polymer RDL with 2 μm Pitch and Beyond
2024· 1 cited
Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications
2024· 1 cited
Multiple Patterning Lithography
2020
Special Section Guest Editorial: Alternative Lithographic Technologies V
Journal of Micro/Nanolithography MEMS and MOEMS·2016Open Access
Tracking defectivity of EUV and SADP processing using bright-field inspection
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2014
Understanding device impact of line edge/width roughness in frequency domain
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2013· 6 cited
Small particle defect characterization on critical layers of 22nm Spacer Self-Aligned Double Patterning (SADP)
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2012· 2 cited
Block copolymer directed self-assembly enables sublithographic patterning for device fabrication
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2012· 41 citedOpen Access
Directed self-assembly defectivity assessment. Part II
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2012· 67 cited
Characterization of EUV resists for defectivity at 32nm
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011
Innovative self-aligned triple patterning for 1x half pitch using single "spacer deposition-spacer etch" step
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011· 12 cited
EUV defect characterization study on post litho and etch for 1x and 2x node processes
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011
Mandrel-based patterning: density multiplication techniques for 15nm nodes
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011· 20 cited
Self-assembly patterning for sub-15nm half-pitch: a transition from lab to fab
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011· 106 cited
Double patterning compliant logic design
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011· 16 cited
Self-aligned triple patterning for continuous IC scaling to half-pitch 15nm
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011· 27 cited
Defect Gallery and Bump Defect Reduction in the Self-Aligned Double Patterning Module
IEEE Transactions on Semiconductor Manufacturing·2011· 10 cited
単一”スペーサ成長-スペーサエッチング”工程を用いた1xnmハーフピッチの革新的自己整合3重パターン化
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2011
Experimental demonstration of aperiodic patterns of directed self-assembly by block copolymer lithography for random logic circuit layout
2010· 24 cited
Defect gallery and bump defect reduction in the self Aligned Double Patterning module
2010· 2 cited
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Frequent Co-authors

Chris Ngai(14), Yong Mei Chen(12), Huixiong Dai(12), Xumou Xu(8), Liyan Miao(6), Man-Ping Cai(5), Kfir Dotan(5), Jason Sweis(4), Ping Xu(4), He Yi(3), Ofir Montal(3), H.‐S. Philip Wong(3), Xinyu Bao(3), Li‐Wen Chang(3), Lior Huli(2), Jeffrey Smith(2), Cathy Cai(2), Yongmei Chen(2), Joy Cheng(2), Daniel P. Sanders(2)