Priya Mukundhan

Onto Innovation (United States) — United States

Engineering · Physical Sciences

7h-index116citations35works0.02yr avg
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Research Topics

Ultrasonics and Acoustic Wave Propagation(16), Integrated Circuits and Semiconductor Failure Analysis(10), Advanced Surface Polishing Techniques(7), Advanced ceramic materials synthesis(6), Semiconductor materials and devices(6)

Publications35 total

Application of Picosecond Acoustic Metrology for monitoring Metal Films in Advanced Packaging
IMAPSource Proceedings·2025Open Access
Applications of Picosecond Laser Acoustics to Power Semiconductor Device: IGBT and MOSFET
2023· 1 cited
Advanced Modeling Techniques Expand the Applications of Picosecond Laser Acoustics for RF Process Monitorina
2022 China Semiconductor Technology International Conference (CSTIC)·2022
Imaging of buried overlay and alignment markers using picosecond acoustic microscopy
Metrology, Inspection, and Process Control XXXVI·2022
Non-Contact, In-Line Thermal Characterization Capability with Time Domain Thermoreflectance
2022
Imaging of Overlay and Alignment Markers Under Opaque Layers Using Picosecond Laser Acoustic Measurements : AM: Advanced Metrology
2021
Advantages of Picosecond Ultrasonic Technology for Advanced RF Metrology
2021
Characterization of Sub-micron Metal Line Arrays Using Picosecond Ultrasonics
2020
Full Metrology Solutions for Advanced RF with Picosecond Ultrasonic Metrology
2020
Monitoring Critical Process Steps in 3D NAND using Picosecond Ultrasonic Metrology with both Thickness and Sound Velocity Capabilities
2020· 1 cited
Application of Acoustic Metrology for In-Line Microbump Process Monitoring in Advanced Packaging
Wafer-Level Packaging Symposium·2019
Application of Acoustic Metrology for In-Line Microbump Process Monitoring in Advanced Packaging
2019
Non-destructive In-line IMC Thickness Measurement Using Acoustic Metrology for 3D Stacking
IMAPSource Proceedings·2019· 2 cited
Acoustic Metrology for Fine Pitch Microbumps in 3DIC
2019· 1 cited
Controlling TC SAW Filter Frequency with Picosecond Ultrasonics
2019
Enhancements to Picosecond Acoustic Metrology for application in FO-WLP Process
IMAPSource Proceedings·2018
Picosecond ultrasonics: Characterization of single crystal piezoelectric materials for advanced RF filters
2018· 1 cited
Monitoring critical process steps in 3D nand and advanced RF using picosecond ultrasonic metrology
2018
Non-destructive acoustic metrology and void detection in 3×50μm TSV
2016· 3 cited
Copper process control with picosecond ultrasonic technology: A study
2016
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Frequent Co-authors

R. Mair(15), M. Mehendale(15), Jisen Dai(11), Michael Kotelyanskii(9), Timothy J. Kryman(7), Johnny Dai(6), Cheolkyu Kim(6), Henry H. Du(5), Todd W. Murray(5), S. P. Withrow(4), Xueping Ru(4), Janusz Bogdanowicz(3), Anne-Laure Charley(3), Yong S. Cheong(2), C. Kim(2), J. Y. Wu(2), Jianhao Tan(2), M. Liebens(2), Eric Beyne(2), Andrew Bakir(2)