Johnny Dai

Onto Innovation (United States) — United States

Engineering · Physical Sciences

1h-index11citations8works0.02yr avg
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Research Topics

Ultrasonics and Acoustic Wave Propagation(4), Advanced Sensor Technologies Research(3), Integrated Circuits and Semiconductor Failure Analysis(3), Surface Roughness and Optical Measurements(2), Advanced Fiber Optic Sensors(1)

Publications8 total

Metal Thickness Measurement with PULSE<sup>™</sup> Technology for Advanced Packaging Process Control
2024
Applications of Picosecond Laser Acoustics to Power Semiconductor Device: IGBT and MOSFET
2023· 1 cited
Advanced Modeling Techniques Expand the Applications of Picosecond Laser Acoustics for RF Process Monitorina
2022 China Semiconductor Technology International Conference (CSTIC)·2022
Advantages of Picosecond Ultrasonic Technology for Advanced RF Metrology
2021
Full Metrology Solutions for Advanced RF with Picosecond Ultrasonic Metrology
2020
Monitoring Critical Process Steps in 3D NAND using Picosecond Ultrasonic Metrology with both Thickness and Sound Velocity Capabilities
2020· 1 cited
Monitoring critical process steps in 3D nand and advanced RF using picosecond ultrasonic metrology
2018
Towards Understanding Early Failures Behavior during Device Burn-In: Broadband RF Monitoring of Atomistic Changes in Materials
ECS Journal of Solid State Science and Technology·2016· 9 citedOpen Access

Frequent Co-authors

Cheolkyu Kim(7), Priya Mukundhan(6), R. Mair(4), M. Mehendale(2), Kwansoon Park(2), Johnny Mu(2), Yaw S. Obeng(1), Chukwudi Okoro(1), Papa K. Amoah(1), Victor Vartanian(1), Calvin Wang(1), Ewen Wang(1), Sanghyun Bae(1), Dae-Seo Park(1), Junghwan Kim(1), Hwanpil Park(1), G. A. Antonelli(1), Xinglin Zeng(1), Tim Kryman(1), Frank Zheng(1)