A. Gutierrez-Aitken

Northrop Grumman (United States) — United States

Engineering · Physical Sciences

16h-index850citations98works1.02yr avg
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Research Topics

Radio Frequency Integrated Circuit Design(53), Semiconductor Quantum Structures and Devices(33), Photonic and Optical Devices(25), Microwave Engineering and Waveguides(20), Semiconductor Lasers and Optical Devices(20)

Publications98 total

Advanced 3D Heterogenous Integration (3DHI) for High Frequency RF Applications
2024· 1 cited
High Density Integration/Multi-Function Assemblies, Photonics, and mm-Wave components
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022·2022· 2 cited
Heterogeneous Integration for High Frequency RF Applications
2020· 4 cited
Integrated photonics for hyperspectral sensing
2020
A Photonic Spectrometer for Enhanced Sustainable Land Imaging
2019· 2 cited
Heterogeneously Integrated V-Band Amplifier
2018· 2 cited
Reconfigurable composite right/left-handed metamaterial
2018
(Invited) Diverse Accessible Heterogeneous Integration (DAHI) Foundry at Northrop Grumman Aerospace Systems (NGAS)
ECS Meeting Abstracts·2017
W-Band InP HBT Power Amplifiers
IEEE Microwave and Wireless Components Letters·2017· 8 cited
(Invited) Diverse Accessible Heterogeneous Integration (DAHI) Foundry at Northrop Grumman Aerospace Systems (NGAS)
ECS Transactions·2017· 2 cited
Heterogeneously Integrated W-Band Downconverter
IEEE Microwave and Wireless Components Letters·2017· 6 cited
V-band electronically reconfigurable metamaterial
Journal of Applied Physics·2017· 1 cited
A Meeting of Materials: Integrating Diverse Semiconductor Technologies for Improved Performance at Lower Cost
IEEE Microwave Magazine·2017· 20 cited
W-band InP transmission line metamaterial
2017· 3 cited
(Invited) Diverse Accessible Heterogeneous Integration (DAHI) Foundry at Northrop Grumman Aerospace Systems (NGAS)
ECS Meeting Abstracts·2016
(Invited) Diverse Accessible Heterogeneous Integration (DAHI) Foundry at Northrop Grumman Aerospace Systems (NGAS)
ECS Transactions·2016· 4 cited
Sub-millimeter wave InP technologies and integration techniques
2015· 22 cited
InP HBT transferred substrate amplifiers operating to 600 GHz
2015· 18 cited
Diverse Accessible Heterogeneous Integration (DAHI) at Northrop Grumman Aerospace Systems (NGAS)
2014· 15 cited
InP HBT/Si CMOS-Based 13-b 1.33-Gsps Digital-to-Analog Converter With > 70-dB SFDR
IEEE Journal of Solid-State Circuits·2013· 13 cited
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Frequent Co-authors

A.K. Oki(32), E. Kaneshiro(20), D.C. Streit(19), D. Scott(15), B. Oyama(14), C. Monier(14), K.W. Kobayashi(13), T. Block(12), D. Sawdai(10), J. Cowles(8), A. Cavus(8), L.T. Tran(6), P. Chin(6), R. Lai(6), V. Radisic(6), Khanh Thai(6), H.C. Yen(5), Ken Sato(5), R.S. Kagiwada(5), Fumio Yamada(4)