K. N. Tu

City University of Hong Kong — Hong Kong

Engineering · Physical Sciences

61h-index16.2kcitations205works8.52yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(96), 3D IC and TSV technologies(66), Semiconductor materials and interfaces(64), Copper Interconnects and Reliability(59), Intermetallics and Advanced Alloy Properties(33)

Publications205 total

Large-scale multimodal model based embodied intelligent robots: A survey
Engineering Applications of Artificial Intelligence·2025
Synergistic Microstructures, Mechanical Properties, and Piezoresistive Performance Improvement of Nanoengineered Cementitious Composites by CNT and GNP
Buildings·2025Open Access
Electromigration failure induced by interdiffusion between Al trace and Cu seed layer in the immortal microbump in three-dimensional integrated circuit
Journal of Materials Research and Technology·2025· 3 citedOpen Access
Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging
Journal of Alloys and Compounds·2025· 3 citedOpen Access
To suppress tin whisker growth by using (100)-oriented copper
Journal of Materials Research and Technology·2025· 4 citedOpen Access
Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints
Electronic Materials Letters·2024· 6 citedOpen Access
Effect of Joule heating on the reliability of microbumps in 3D IC
Journal of Materials Research and Technology·2024· 19 citedOpen Access
Non-fragile extended dissipative synchronization control for uncertain discrete-time neural networks with leakage and unbounded time-varying delays
Chaos Solitons & Fractals·2024· 11 cited
Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
Scripta Materialia·2024· 15 cited
Observer-based resilient dissipativity control for discrete-time memristor-based neural networks with unbounded or bounded time-varying delays
Neural Networks·2024· 27 cited
A new approach based on system solutions for passivity analysis of discrete-time memristor-based neural networks with time-varying delays
Applied Mathematics and Computation·2024· 5 cited
Void ripening in Cu-Cu bonds
2021
Low Resistance and High Electromigration Lifetime of Cu-To-Cu Joints Using (111)-Oriented Nanotwinned Copper
Advanced Materials Letters·2021· 3 citedOpen Access
A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu
Journal of Materials Research and Technology·2021· 31 citedOpen Access
Hybrid Bonding of Nanotwinned Copper/organic Dielectrics with Low Thermal Budget
2021· 13 cited
Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility
Electrochimica Acta·2021· 54 cited
Effect of anisotropic grain growth on improving the bonding strength of <111>-oriented nanotwinned copper films
Materials Science and Engineering A·2021· 48 cited
Deformation induced columnar grain rotation in nanotwinned metals
Materials Science and Engineering A·2020· 18 cited
Effect of Thermal Stress on Anisotropic Grain Growth in Nano-Twinned and Un-Twinned Copper Films
SSRN Electronic Journal·2020· 2 citedOpen Access
A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
Journal of Applied Physics·2019· 42 cited
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Frequent Co-authors

Woon‐Seop Choi(4), Chih Chen(4), J. W. Mayer(3), M. O. Aboelfotoh(3), Yingxia Liu(3), Ke Zeng(2), R. D. Thompson(2), P. G. Kim(2), D. R. Frear(2), Wei Chu(2), Iwao Ohdomari(2), A. Cros(2), H. K. Kim(2), Yu Young Bong(2), Luu Nguyen(2), Munehiro Date(2), T. Shoji(2), M. Fujiyoshi(2), Kazunori Sato(2), F. Nava(2)