Vaidehi Oruganti

Microsoft (United States) — United States

Engineering · Physical Sciences

5h-index96citations9works12.42yr avg
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Research Topics

Heat Transfer and Optimization(4), 3D IC and TSV technologies(3), Thermal properties of materials(2), Nanofabrication and Lithography Techniques(2), Green IT and Sustainability(2)

Publications9 total

Using life cycle assessment to drive innovation for sustainable cool clouds
Nature·2025· 26 citedOpen Access
Toward TSV-Compatible Microfluidic Cooling for 3D ICs
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 11 cited
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
Journal of Electronic Packaging·2024· 12 cited
Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI)
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 9 cited
Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density
2024· 4 cited
A Tale of Two Mice: Sustainable Electronics Design and Prototyping
CHI Conference on Human Factors in Computing Systems Extended Abstracts·2022· 31 citedOpen Access
A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems
2021
An Experimental Study of a Single Droplet Impacting Onto a Heated Surface at High Impact Weber Numbers
2019
Experiments on the thermal resistance of deformable thermal interface materials under mechanical loading
2017· 3 cited

Frequent Co-authors

Husam A. Alissa(6), Bharath Ramakrishnan(6), Christian Belady(5), Geyu Yan(3), Euichul Chung(3), Muhannad S. Bakir(3), Nicholas Keehn(2), Ioannis Manousakis(2), Erik W. Masselink(2), Shane Oh(2), Alfonso Ortega(2), Vicente Arroyos(1), Maria Viitaniemi(1), Winston A. Saunders(1), Karin Strauß(1), Vikram Iyer(1), Bichlien H. Nguyen(1), Teresa Nick(1), Ashish Raniwala(1), Alberto Arribas Herranz(1)