Geyu Yan

Georgia Institute of Technology — United States

Engineering · Physical Sciences

4h-index37citations8works5.52yr avg
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Research Topics

3D IC and TSV technologies(3), Heat Transfer and Optimization(2), Semiconductor Lasers and Optical Devices(2), Nanofabrication and Lithography Techniques(2), Photonic and Optical Devices(1)

Publications7 total

Toward TSV-Compatible Microfluidic Cooling for 3D ICs
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 11 cited
Heterogeneous Integration Enabled by 3-D Stitch-Chips
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 1 cited
Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI)
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 9 cited
Opto-Myomatrix: μLED Integrated Microelectrode Arrays for Optogenetic Activation and Electrical Recording in Muscle Tissue
2024· 4 citedOpen Access
Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density
2024· 4 cited
Novel Modulation Technique For Microwave Frequencies
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·1989
Externally modulated mode-locked laser diodes for microwave transmission links
Electronics Letters·1989· 4 cited

Frequent Co-authors

Muhannad S. Bakir(5), Euichul Chung(4), Shane Oh(4), Bharath Ramakrishnan(3), Vaidehi Oruganti(3), Husam A. Alissa(3), Christian Belady(3), Erik W. Masselink(2), Muneeb Zia(2), Albert L. Kellner(2), B. C. Lam(2), Paul K. L. Yu(2), Samuel J. Sober(2), Yunhyeok Im(1), Yogendra Joshi(1), Jiaao Lu(1), Danish A. Baig(1), Jeong Jun Kim(1), Philip Anschutz(1), Daniel H. O’Connor(1)