R.J.O.M. Hoofman

IMEC — Belgium

Materials Science · Physical Sciences

16h-index1.0kcitations53works0.02yr avg
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Research Topics

Copper Interconnects and Reliability(24), Semiconductor materials and devices(22), 3D IC and TSV technologies(7), Polydiacetylene-based materials and applications(7), Metal and Thin Film Mechanics(6)

Publications53 total

Silicon photonics open access foundry services review for emerging technology
2021· 6 citedOpen Access
Postgraduate level analog microelectronics course based on cadence IC software and AMS 0.35 µm technology
International Journal of Electrical Engineering Education·2021
Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies
2021· 1 citedOpen Access
PIX4life’s silicon nitride integrated photonics platforms: present status and future outlook
2020· 1 cited
Monolithic photonic integration for visible and short near-infrared wavelengths: technologies and platforms for bio and life science applications
Advanced Optical Technologies·2018· 2 cited
Integrated bio-photonics to revolutionize health care enabled through PIX4life and PIXAPP
2018· 11 cited
PIX4life: photonic integrated circuits for bio-photonics
Advanced Photonics 2018 (BGPP, IPR, NP, NOMA, Sensors, Networks, SPPCom, SOF)·2018· 4 cited
A 7 <i>μ</i>W Offset- and Temperature-Compensated pH-to-Digital Converter
Journal of Sensors·2017· 6 citedOpen Access
A 7μW Offset-and Temperature-Compensated pH-to-Digital Converter
2017
FROM SENSOR OUTPUT TO IMPROVED PRODUCT QUALITY
Acta Horticulturae·2015· 8 citedOpen Access
Integration Of Cmos Biosensor Into A Polymeric Lab-On-A-Chip System
Zenodo (CERN European Organization for Nuclear Research)·2013· 1 citedOpen Access
A 7&amp;#x03BC;W pH-to-digital converter for quality monitoring of perishable products
2013· 1 cited
A low-power CMOS integrated sensor for CO&lt;inf&gt;2&lt;/inf&gt; detection in the percentage range
2013· 6 cited
Smart sensor technologies for cold chain quality monitoring.
2013· 5 cited
CMOS biosensor platform
2010· 29 cited
Air gap formation by UV-assisted decomposition of CVD material
Microelectronic Engineering·2008· 14 cited
Comparison of n- and p-type high efficiency silicon solar cell performance under low illumination conditions
Conference record of the IEEE Photovoltaic Specialists Conference·2008· 16 cited
Void growth modeling upon electromigration stressing in narrow copper lines
Journal of Applied Physics·2007· 24 cited
The evolution of multi-level air gap integration towards 32 nm node interconnects
Microelectronic Engineering·2007· 22 cited
Integration of Low‐ <i>k</i> Dielectric Films in Damascene Processes
2007· 13 cited
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Frequent Co-authors

J. Michelon(14), R. Daamen(12), P.H.L. Bancken(9), Laurens D. A. Siebbeles(8), A. Humbert(8), Matthijs P. de Haas(7), G.J.A.M. Verheijden(7), L.G. Gosset(7), V. Arnal(7), Gerald Beyer(6), Việt Hùng Nguyễn(6), John M. Warman(5), Francesca Iacopi(5), C. Bruynseraede(5), Douwe Geuzebroek(5), D. Bloor(4), J. Torrès(4), Rudy Caluwaerts(4), Michiel A. P. Pertijs(4), Youssef Travaly(3)