R. Daamen

NXP (Netherlands) — Netherlands

Materials Science · Physical Sciences

12h-index413citations26works0.02yr avg
OpenAlex↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

Copper Interconnects and Reliability(17), Semiconductor materials and devices(13), 3D IC and TSV technologies(8), Advanced Surface Polishing Techniques(6), Advanced machining processes and optimization(4)

Publications26 total

A 1.2-V 8.3-nJ CMOS Humidity Sensor for RFID Applications
IEEE Journal of Solid-State Circuits·2013· 137 cited
A 1.2V 8.3nJ energy-efficient CMOS humidity sensor for RFID applications
2012· 25 cited
A 1.8V 11μW CMOS smart humidity sensor for RFID sensing applications
2011· 29 cited
Air gap formation by UV-assisted decomposition of CVD material
Microelectronic Engineering·2008· 14 cited
The evolution of multi-level air gap integration towards 32 nm node interconnects
Microelectronic Engineering·2007· 22 cited
Multi-Level Air Gap Integration for 32/22nm nodes using a Spin-on Thermal Degradable Polymer and a SiOC CVD Hard Mask
2007· 16 cited
Chemical etching solutions for air gap formation using a sacrificial oxide/polymer approach
Microelectronic Engineering·2006· 17 cited
Self Aligned Barrier Approach: Overview on Process, Module Integration and Interconnect Performance Improvement Challenges
2006· 9 cited
Alternatives to nano-porous materials: Low-k dielectric air-gap integration
2006
A Confluence of Narratives: Cultural Perspectives in Postmodernist Scottish Fiction
2006
Spectral photoresponse of advanced interconnects: a possible solution to the ITRS most difficult characterization challenges
2006· 2 cited
Benefits and Trade-offs in Multi-Level Air Gap Integration
MRS Proceedings·2006· 3 cited
Production of 150nm wide Air Gap Interconnects with a "Sacrificial Materials Approach" and a "Close-off Approach"
Data Archiving and Networked Services (DANS)·2005Open Access
Air gap integration for the 45nm node and beyond
2005· 8 cited
Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics
2005· 12 cited
Advanced Cu interconnects using air gaps
Microelectronic Engineering·2005· 30 cited
Q enhancement with cross-connected coplanar waveguides in thick dual damascene Cu
IEEE MTT-S International Microwave Symposium Digest, 2005.·2005· 1 cited
Process optimisation and dual damascene integration of porous CVD SiOC dielectric at 2.4 and 2.2 k-values for 45 nm CMOS technology
2004· 2 cited
RF-performance of thick damascene Cu interconnect on silicon
2004· 3 cited
Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process
Microelectronic Engineering·2004· 18 cited
page 1 of 2Next →

Frequent Co-authors

R.J.O.M. Hoofman(13), P.H.L. Bancken(9), L.G. Gosset(8), G.J.A.M. Verheijden(8), J. Michelon(8), A. Humbert(7), Việt Hùng Nguyễn(7), V. Arnal(6), J. Torrès(6), V. Nguyen Hoang(4), H. van Kranenburg(4), Peter G. van der Velden(4), P.H. Woerlee(4), Zhichao Tan(3), Y.V. Ponomarev(3), Youngcheol Chae(3), Michiel A. P. Pertijs(3), J. de Pontcharra(3), F. Gaillard(3), D. Bouchu(3)