F. Gaillard

Commissariat à l'Énergie Atomique et aux Énergies Alternatives — France

Engineering · Physical Sciences

13h-index525citations38works0.02yr avg
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Research Topics

Semiconductor materials and devices(16), Copper Interconnects and Reliability(9), Electrochemical Analysis and Applications(7), 3D IC and TSV technologies(7), Innovative Energy Harvesting Technologies(5)

Publications38 total

Methodology for an efficient characterization flow of industrial grade Si-based qubit devices
2022 International Electron Devices Meeting (IEDM)·2022· 3 cited
FDSOI for cryoCMOS electronics: device characterization towards compact model
2022 International Electron Devices Meeting (IEDM)·2022· 13 cited
65nm RFSOI Power Amplifier Transistor Ageing at mm W frequencies, 14 GHz and 28 GHz
2021 IEEE International Electron Devices Meeting (IEDM)·2021· 8 cited
RF Performance of a Fully Integrated 3D Sequential Technology
2019· 5 cited
Performance and Reliability of a Fully Integrated 3D Sequential Technology
2018· 14 cited
Full 300 mm electrical characterization of 3D integration using High Aspect Ratio (10:1) mid-process through silicon vias
2015· 1 cited
A disruptive technology for thermal to electrical energy conversion
Microelectronics Journal·2014· 5 cited
An innovative heat harvesting technology (HEATec) for above-Seebeck performance
2012· 14 cited
A disruptive technology for thermal to electrical energy conversion
International Workshop on Thermal Investigations of ICs and Systems·2012· 1 cited
Scale laws for enhanced power for MEMS based heat energy harvesting
2012· 6 cited
Innovative thermal energy harvesting for zero power electronics
2012· 23 cited
CVD of Ru, Pt and Pt-based alloy thin films using ethanol as mild reducing agent
Materials Chemistry and Physics·2010· 18 cited
300 mm Multi Level Air Gap Integration for Edge Interconnect Technologies and Specific High Performance Applications
2008· 9 cited
Multi levels Air gap Integration using Sacrificial Material Approach for Advanced Cu Interconnects Technologies
HAL (Le Centre pour la Communication Scientifique Directe)·2008
Effect of elaboration parameters on ionic conductivity for PECVD fuel cell electrolyte
Ionics·2007· 6 cited
Multi-Level Cu Interconnects Integration and Characterization with Air Gap as Ultra-Low K Material Formed using a Hybrid Sacrificial Oxide / Polymer Stack
2007· 13 cited
Chemical etching solutions for air gap formation using a sacrificial oxide/polymer approach
Microelectronic Engineering·2006· 17 cited
Spectral photoresponse of advanced interconnects: a possible solution to the ITRS most difficult characterization challenges
2006· 2 cited
Advanced Cu interconnects using air gaps
Microelectronic Engineering·2005· 30 cited
Copper Decontamination Ability of Supercritical-CO<sub>2</sub>/Additives on CVD and Spin-On Porous MSQ Materials
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena·2005· 2 cited
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Frequent Co-authors

Eric Levillain(8), J. P. Lelieur(7), D. Bouchu(7), G. Passemard(6), J. Torrès(5), S. Monfray(5), O. Puscasu(5), G. Savelli(5), Daniel Guyomar(5), F. Bœuf(5), T. Skotnicki(5), A. Demortier(4), L.G. Gosset(4), Christophe Maitre(4), P. Ancey(4), M. Cassé(4), A. Farcy(3), J. de Pontcharra(3), Ph. Lyan(3), R. Daamen(3)