John Osenbach

Bio Med Sciences (United States) — United States

Engineering · Physical Sciences

22h-index1.8kcitations110works0.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(31), Semiconductor materials and devices(25), Photonic and Optical Devices(21), 3D IC and TSV technologies(19), Optical Network Technologies(17)

Publications110 total

Modeling Short-and Long-Term NTC Thermistor Resistance Drift
IEEE Transactions on Device and Materials Reliability·2025
Demonstration of a 2 × 800 Gb/s/wave Coherent Optical Engine Based on an InP Monolithic PIC
Journal of Lightwave Technology·2021· 18 cited
Reliability of optoelectronic module An Introduction
2021
High-performance 100 Gbaud Coherent Photonic Modules
2021· 7 cited
$2\times 800$ Gbps/wave Coherent Optical Module Using a Monolithic InP Transceiver PIC
2020· 5 cited
800G over 1000 km enabled by real-time DSP ASIC employing Probabilistic Shaping and Digital Sub-Carrier Multiplexing
2020· 4 cited
800G DSP ASIC Design Using Probabilistic Shaping and Digital Sub-Carrier Multiplexing
Journal of Lightwave Technology·2020· 273 citedOpen Access
InP-based Transceivers for Generation and Transmission of 800 Gbit/s Signals
OSA Advanced Photonics Congress (AP) 2020 (IPR, NP, NOMA, Networks, PVLED, PSC, SPPCom, SOF)·2020· 1 cited
1.6Tbps Coherent 2-Channel Transceiver Using a Monolithic Tx/Rx InP PIC and Single SiGe ASIC
2020· 31 cited
2-Channels × 100 GBd 32QAM Transmission over 500 km Enabled by InP PICs and SiGe ASICs
2019· 4 cited
InP-based Coherent PICs for 100 Gbaud Operation
2019· 2 cited
<tex>$4 \times 600$</tex> Gb/s Photonic IC Transmitter and Receiver Modules
2018· 5 cited
1.00 (0.88) Tb/s per Wave Capable Coherent Multi-Channel Transmitter (Receiver) InP-Based PICs With Hybrid Integrated SiGe Electronics
IEEE Journal of Quantum Electronics·2018· 29 cited
Multi-channel InP-based Coherent PICs with Hybrid Integrated SiGe Electronics Operating up to 100 GBd, 32QAM
2017· 29 cited
Extended C-band tunable multi-channel InP-based coherent receiver PICs
Optics Express·2017· 18 citedOpen Access
System-on-Chip Photonic Integrated Circuits
IEEE Journal of Selected Topics in Quantum Electronics·2017· 161 cited
Extended C-Band Tunable Multi-Channel InP-Based Coherent Transmitter PICs
Journal of Lightwave Technology·2017· 55 cited
Development fine pitch area array Cu pillar/lead free solder bumps for large 28nm die in large organic flip chip packages
2014· 2 cited
Development of exposed die large body to die size ratio wafer level package technology
2014· 9 cited
2L OMEDFC development for larger package to die size ratio in thinner core
2013
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Frequent Co-authors

V. Lal(9), S. Corzine(9), M. Ziari(9), Peter Evans(7), T. Butrie(7), Ryan Going(7), T. Vallaitis(7), M. Küntz(7), W. R. Knolle(7), Han Sun(6), S. Buggaveeti(6), Fred Kish(6), P. Studenkov(6), J. M. DeLucca(6), Jiaming Zhang(5), Parmijit Samra(5), Amir Hosseini(5), M. Lauermann(5), Jie Tang(5), D. Pavinski(5)