G.V. Kopcsay

IBM (United States)United States

Engineering · Physical Sciences

25h-index2.3kcitations96works0.02yr avg

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Research Topics

Electromagnetic Compatibility and Noise Suppression(45), 3D IC and TSV technologies(26), Microwave and Dielectric Measurement Techniques(24), Terahertz technology and applications(21), Low-power high-performance VLSI design(17)

Publications96 total

Journal of Thermal Science and Engineering Applications·2013· 11 cited
IEEE Transactions on Advanced Packaging·2007· 31 cited
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)·2005· 37 cited
IBM Journal of Research and Development·2005· 42 cited
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Frequent Co-authors

A. Deutsch(33), C.W. Surovic(19), G. Arjavalingam(16), P. Coteus(15), B.J. Rubin(13), H.H. Smith(8), G. Katopis(7), B. Krauter(7), R.A. Haring(7), Y. Pastol(7), Dale Becker(6), Rajiv Dunne(6), Tom Gallo(6), Lewis M. Terman(6), George Almási(6), Alan Gara(6), Shawn A. Hall(6), Todd Takken(6), J.-M. Halbout(6), H. Smith(6)