IBM (United States) — United States
Engineering · Physical Sciences
25h-index2.3kcitations96works0.02yr avg
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Research Topics
Electromagnetic Compatibility and Noise Suppression(45), 3D IC and TSV technologies(26), Microwave and Dielectric Measurement Techniques(24), Terahertz technology and applications(21), Low-power high-performance VLSI design(17)
Publications96 total
Journal of Thermal Science and Engineering Applications·2013· 11 cited
IEEE Transactions on Electromagnetic Compatibility·2010· 22 cited
IEEE Transactions on Advanced Packaging·2007· 31 cited
IEEE Transactions on Advanced Packaging·2006· 3 cited
Proceedings·2006· 1 cited
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)·2005· 37 cited
2005· 28 cited
Electrical Performance of Electronic Packaging·2005· 2 cited
IBM Journal of Research and Development·2005· 42 cited
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Frequent Co-authors
A. Deutsch(33), C.W. Surovic(19), G. Arjavalingam(16), P. Coteus(15), B.J. Rubin(13), H.H. Smith(8), G. Katopis(7), B. Krauter(7), R.A. Haring(7), Y. Pastol(7), Dale Becker(6), Rajiv Dunne(6), Tom Gallo(6), Lewis M. Terman(6), George Almási(6), Alan Gara(6), Shawn A. Hall(6), Todd Takken(6), J.-M. Halbout(6), H. Smith(6)