Johan De Baets

Ghent University — Belgium

Engineering · Physical Sciences

16h-index768citations110works0.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(24), 3D IC and TSV technologies(19), Semiconductor materials and devices(17), Thin-Film Transistor Technologies(15), Semiconductor Lasers and Optical Devices(15)

Publications110 total

An Artificial Iris ASIC with High Voltage Liquid Crystal Driver, 10 nA Light Range Detector and 40 nA Blink Detector for LCD Flicker Removal
2020· 4 citedOpen Access
An Artificial Iris ASIC With High Voltage Liquid Crystal Driver, 10-nA Light Range Detector and 40-nA Blink Detector for LCD Flicker Removal
IEEE Solid-State Circuits Letters·2020· 10 citedOpen Access
FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
2019
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
2017· 22 cited
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Microelectronics Reliability·2017· 13 citedOpen Access
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
2016· 3 citedOpen Access
Passive component embedding in printed circuit boards for space applications
Ghent University Academic Bibliography (Ghent University)·2016Open Access
9.4: Stretchable 45 × 80 RGB LED Display Using Meander Wiring Technology
SID Symposium Digest of Technical Papers·2015· 19 cited
Stretchable 45 x 80 RGB LED display using meander wiring technology
Ghent University Academic Bibliography (Ghent University)·2015· 1 cited
Flexible and stretchable electronics for wearable healthcare
2014· 15 cited
Embedded passive components for improved power plane decoupling
2014· 1 cited
Mechanical analysis of encapsulated metal interconnects under transversal load
2014· 1 cited
Reduced 2nd level solder joint life time of low-CTE mold compound packages
Ghent University Academic Bibliography (Ghent University)·2014· 1 citedOpen Access
Flexible and stretchable circuit technologies for space applications
Ghent University Academic Bibliography (Ghent University)·2014· 1 citedOpen Access
Stretchable Circuits with Horseshoe Shaped Conductors Embedded in Elastic Polymers
Japanese Journal of Applied Physics·2013· 57 citedOpen Access
In situ monitoring of urine and sweat contamination in bed linen
Ghent University Academic Bibliography (Ghent University)·2013
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
IMAPSource Proceedings·2013Open Access
Plastic electronics based conformable electronic circuits
2012 4th Electronic System-Integration Technology Conference·2012· 3 cited
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
2012 4th Electronic System-Integration Technology Conference·2012· 7 citedOpen Access
Surface Modification of a Photo-Definable Epoxy Resin with Polydopamine to Improve Adhesion with Electroless Deposited Copper
Journal of Adhesion Science and Technology·2012· 25 cited
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Frequent Co-authors

André Van Calster(28), Jan Vanfleteren(26), Herbert De Smet(15), I. De Rycke(13), Jan Doutreloigne(11), Jeroen van den Brand(7), J. Capon(7), Maarten Cauwe(6), Alfons Vervaet(5), Frederick Bossuyt(4), David Schaubroeck(4), Andreas Dietzel(3), Rik Verplancke(3), Lieven Degrendele(3), J. F. J. van den Brand(2), Mario González(2), Tim Desmet(2), Etienne Schacht(2), Andreas Ostmann(2), Dionysios Manessis(2)