Takashi Hamada

Earth and Planetary Sciences · Physical Sciences

19h-index1.4kcitations179works5.72yr avg
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Research Topics

Paleontology and Stratigraphy of Fossils(40), Geology and Paleoclimatology Research(20), Silicone and Siloxane Chemistry(19), Semiconductor materials and devices(14), Thin-Film Transistor Technologies(14)

Publications179 total

Effect of component of inorganic-organic hybrid resist materials on resist performance for EB and EUV lithography
2026
Reply to “Geographical Accessibility Does Not Affect Prognosis After Living‐Donor Liver Transplantation”
Annals of Gastroenterological Surgery·2025Open Access
Safety and oncologic outcomes of open versus minimally invasive distal pancreatectomy for resectable pancreatic body and tail cancer
Hepatobiliary & pancreatic diseases international·2025
Effects of Tetraethylene Glycol Chains and Amine Hydrochloride Salts on the Antifogging Performance of Amino-Functionalized Polysilsesquioxanes
ACS Applied Engineering Materials·2025
Antifogging Materials: Design and Synthesis of Water-Absorbing Polymer Films and Their Antifogging Properties
2025
End‐to‐End Pierced Carbon Nanosheets with Meso‐Holes
Advanced Science·2024· 11 citedOpen Access
Quaternary ammonium-functionalized polysilsesquioxanes for antifogging coating
RSC Applied Polymers·2024· 1 citedOpen Access
A Case of Resectable Single-Nodule Intrahepatic Bile Duct Adenoma
Cureus·2024Open Access
Substrate Curvature‐Induced Regulation of Charge Distribution of Covalent Organic Frameworks Promotes Capacitive Deionization
Advanced Functional Materials·2024· 44 citedOpen Access
Organic precursors for tailored synthesis of sulfur- and nitrogen-doped mesoporous carbons: a molecular design approach
Chemical Communications·2024· 1 cited
Mesoporous Metastable CuTe<sub>2</sub> Semiconductor
Journal of the American Chemical Society·2023· 7 cited
Soft- and Hard-Error Radiation Reliability of 228 KB $3\mathrm{T}+1\mathrm{C}$ Oxide Semiconductor Memory
2023· 2 cited
Polysilsesquioxane-Containing Thermally Degradable Groups for Potential Application as Thermal Insulation Materials
ACS Applied Polymer Materials·2023· 7 cited
Effect of the Amine Hydrochloride Salt on the Antifogging Properties of Amino-Functionalized Polysilsesquioxane
ACS Applied Polymer Materials·2023· 7 cited
Double-Decker Silsesquioxane-Grafted Polysilsesquioxane Hybrid Films as Thermal Insulation Materials
ACS Applied Polymer Materials·2022· 12 cited
A c-axis aligned crystalline IGZO FET and a 0.06-μm<sup>2</sup> HfO2-based Capacitor 1T1C FeRAM with High Voltage Tolerance and 10-ns Write Time
2022 International Electron Devices Meeting (IEDM)·2022· 5 cited
Highly Durable Antifogging Materials Based on Polysilsesquioxane with Double Hydrophilic Groups: Effect of Bridged Tetraethylene Glycol Chains in Polysilsesquioxane Films
ACS Applied Polymer Materials·2022· 6 cited
Organic–Inorganic Hybrid Thermal Insulation Materials Prepared via Hydrosilylation of Polysilsesquioxane Having Hydrosilyl Groups and Triallylisocyanurate
ACS Applied Polymer Materials·2022· 8 cited
Robust and Transparent Antifogging Polysilsesquioxane Film Containing a Hydroxy Group
Langmuir·2022· 14 cited
Structure–Thermal Property Relationships of Polysilsesquioxanes for Thermal Insulation Materials
ACS Applied Polymer Materials·2022· 15 cited
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Frequent Co-authors

Joji Ohshita(7), Takashi Nagase(6), Kimihiro Matsukawa(6), Hiroyoshi Naito(6), Kenta Okada(6), Teiichi KOBAYASHI(6), Morinobu Endo(5), Masatoshi Furuyama(5), T. Tomioka(5), Takashi Kobayashi(5), Y. Sajiki(4), Shunpei Yamazaki(4), Yasunari Maekawa(3), Saori Yamazaki(3), Shuichi Murakami(3), Yoshiyuki Kobayashi(3), Daisuke Matsubayashi(3), Hideomi Suzawa(3), Yutaka Okazaki(3), T. Yamamoto(3)