Roger Palmans

Materials Science · Physical Sciences

9h-index696citations39works0.02yr avg

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Research Topics

Copper Interconnects and Reliability(18), Electrodeposition and Electroless Coatings(12), Metal and Thin Film Mechanics(7), Semiconductor materials and devices(5), Magnetism in coordination complexes(5)

Publications39 total

ECS Meeting Abstracts·2006Open Access
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena·2005· 5 citedOpen Access
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena·2005· 16 cited
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena·2004· 13 cited
Microelectronic Engineering·2004· 225 cited
Filling of 80 nm structures using a novel copper oxide reduction and reflow approach
2004
The thickness and temperature dependent resistivity of thin copper films
2003· 1 cited
Microelectronic Engineering·2000· 164 cited
Microelectronic Engineering·2000· 47 cited
Integration of electroless and electrolytic Cu and IC back end of line technologies
2000
Direct copper electroplating
2000· 1 cited
Roles of additives during filling process of damascene structures with electrochemical deposited copper
1999
Dry etch process development for FLARE(tm) for dual damascene architecture using a N2/O2 plasma
1999
Integration of electroless and electrolytic Cu in the IC back end line of technologies
1999
The formation of Pd seeded copper layer on TiN substrates by electroless deposition
1998· 3 cited
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Frequent Co-authors

Karen Maex(23), I. Vervoort(8), Sywert Brongersma(7), E. Richard(5), Yuri Lantasov(5), J. D’Olieslager(4), Gerald Beyer(4), Sébastien Lagrange(3), A. J. Frank(3), Arthur J. Frank(3), C. S. Petersson(3), H. Bender(3), J. Keinonen(3), A. Mouroux(3), W. Zhang(2), Richard Ostwald(2), Bert Brijs(2), Ludo Froyen(2), Frank Holsteyns(2), Kun Tack Lee(2)