Olivier Billoint

Commissariat à l'Énergie Atomique et aux Énergies Alternatives — France

Engineering · Physical Sciences

16h-index977citations82works0.92yr avg
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Research Topics

Semiconductor materials and devices(39), 3D IC and TSV technologies(32), Advanced Memory and Neural Computing(21), Ferroelectric and Negative Capacitance Devices(15), Interconnection Networks and Systems(13)

Publications82 total

Resistive Memories: Multifaceted Impact on Neuromorphic Computing
2025
22nm FDSOI Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub> FeRAM Demonstration for Embedded Applications: from Ferroelectric Capacitors to FeRAM Arrays
2025
Robust SPICE Model for FeCap: Application to 16kbit 1T-1C FeRAM Array Simulation
2025· 1 cited
Dual-Mode 16kb Memory: Transforming a Ferroelectric Capacitor Bitcell into Resistive Filamentary Memory
2025· 1 citedOpen Access
Ultra-Thin-Body and Buried Oxide FD-SOI next generation nodes and eNVM technologies for advanced IC design
2025
Pursuing the Fd-Soi Roadmap Down to 10-7nm Nodes for High Energy Efficient, Low Power and Rf/Mmwave Applications
SSRN Electronic Journal·2025Open Access
$\text{Hf}_{0.5}\text{Zr}_{0.5}\mathrm{O}_{2}$ FeRAM Scalability Demonstration at 22nm FDSOI Node for Embedded Applications
2024· 2 cited
Charge-based Sense Demonstration in 1T-1C HZO FeRAM Arrays to Overcome C<sub>BL</sub>-induced Bank Size Limitations
2024· 3 cited
Hybrid FeRAM/RRAM Synaptic Circuit Enabling On-Chip Inference and Learning at the Edge
2023· 6 citedOpen Access
3D sequential integration with Si CMOS stacked on 28nm industrial FDSOI with Cu-ULK iBEOL featuring RO and HDR pixel
2023· 5 cited
Convolution neural network inference using frequency modulation in computational phase-change memory
2023Open Access
Synergetic FeRAM/OxRAM memory array operation induced by oxygen vacancy interface engineering in Si:HfO2 ferroelectric films
2023
RRAM Device Performances Under Capacitive-Enhanced Current Programming Scheme
IEEE Electron Device Letters·2023· 2 citedOpen Access
Memory Window in Si:HfO<sub>2</sub> FeRAM arrays: Performance Improvement and Extrapolation at Advanced Nodes
2023· 7 citedOpen Access
Advanced 3d Design and Technologies for 3-Layer Smart Imager
2022· 4 citedOpen Access
3D sequential integration: applications and associated key enabling modules (design &amp; technology)
2021 IEEE International Electron Devices Meeting (IEDM)·2021· 4 cited
Area and Cost Analysis of the Mixed Signal Circuits in a Novel Monolithic 3D Process
2021· 2 cited
Opportunities and challenges brought by 3D-sequential integration
2021· 1 cited
16kbit 1T1R OxRAM arrays embedded in 28nm FDSOI technology demonstrating low BER, high endurance, and compatibility with core logic transistors
2021· 30 cited
Optimization of RRAM and OTS selector for advanced low voltage CMOS compatibility
2020· 9 cited
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Frequent Co-authors

Sébastien Thuries(25), P. Batude(19), C. Fenouillet-Béranger(17), Fabien Deprat(13), Laurent Brunet(13), M. Vinet(13), G. Cibrario(11), Hossam Sarhan(11), O. Rozeau(10), B. Prévitali(8), F. Clermidy(8), Édith Beigné(8), Fabien Clermidy(8), Ogun Turkyilmaz(7), Pascal Vivet(7), N. Rambal(6), F. Ponthenier(6), F. Andrieu(6), L. Pasini(5), B. Sklénard(5)