Rey Co

Arizona State University — United States

Engineering · Physical Sciences

4h-index24citations15works0.02yr avg
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Research Topics

3D IC and TSV technologies(9), Electronic Packaging and Soldering Technologies(8), VLSI and Analog Circuit Testing(5), GaN-based semiconductor devices and materials(3), Semiconductor Lasers and Optical Devices(2)

Publications15 total

Sub-Micron Patterning & High-Aspect-Ratio Structures in Advanced Substrates with Dry Etching and Liquid Metal Ink Metallization
IMAPSource Proceedings·2025Open Access
High-volume-manufacturing (HVM) of BVA™ enabled advanced package-on-package (PoP)
2015· 1 cited
High-Volume-Manufacturing (HVM) of BVA enabled advanced Package-on-Package (PoP)
2015· 5 cited
BVA™ Technology Enabling the Next Generation of Ultra-Fine Pitch Wide-Io Package-On-Package
Wafer-Level Packaging Symposium·2014
Reconstituted Big-Chip Leds on Multi-Layer Interconnects for High-Brightness Lighting
Wafer-Level Packaging Symposium·2014
Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package
IMAPSource Proceedings·2014· 4 citedOpen Access
High-brightness LEDs of big chip size on multi-layer interconnects with optimized thermal dissipation and optical performance
IMAPSource Proceedings·2014
Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package
SMTA International·2014
Manufacturing readiness of BVA technology for ultra-high bandwidth package-on-package
2014· 7 cited
Wafer level LED packaging with optimal light output and thermal dissipation for high-brightness lighting
2014
A 1020-lead, 240 micron pitch, 14 × 14mm Package-on-Package (PoP) and manufacturing infrastructure
2014· 1 cited
Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)·2014Open Access
Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performance
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)·2014Open Access
Ultra-fine pitch Package on Package solution for high bandwidth mobile applications
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)·2013Open Access
A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications
IMAPSource Proceedings·2013· 6 cited

Frequent Co-authors

Rajesh Katkar(10), Wael Zohni(8), Zhang Ron(4), Gabe Guevara(4), Roseann Alatorre(4), Liang Wang(3), Hala Shaba(3), Laura Mirkarimi(2), Zhao Zhi-jun(2), Ashok Prabhu(2), Grant Villavicencio(2), Eric Tosaya(2), Rizza Cizek(1), Siyang Liu(1), S. C. Kao(1), Simon McElrea(1), Savita Sharma(1), Roger H. Terrill(1), Hongbin Yu(1), Liang Wang(1)