Gabe Guevara

Xperi (United States) — United States

Engineering · Physical Sciences

8h-index251citations18works0.02yr avg
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Research Topics

3D IC and TSV technologies(10), Electronic Packaging and Soldering Technologies(9), Additive Manufacturing and 3D Printing Technologies(4), GaN-based semiconductor devices and materials(3), Semiconductor Lasers and Optical Devices(2)

Publications18 total

Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration
IMAPSource Proceedings·2024Open Access
Chemistry and Process Considerations for the Removal of Residues for Hybrid Bonding
IMAPSource Proceedings·2024Open Access
Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)·2022· 18 cited
Low Temperature Hybrid Bonding for Die to Wafer Stacking Applications
2021· 15 cited
Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration
2020· 18 cited
Die to Wafer Hybrid Bonding: Multi-Die Stacking with TSV Integration
Wafer-Level Packaging Symposium·2020
Die to Wafer Stacking with Low Temperature Hybrid Bonding
2020· 39 cited
Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study
2019· 28 cited
Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study
Wafer-Level Packaging Symposium·2019
Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
2019· 62 cited
Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment
2018· 30 cited
Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding
2018· 36 cited
High Resolution 3D X-Ray Microscopy for the Development of Wafer Level Packaging and 3D IC Integration
Wafer-Level Packaging Symposium·2014
Reconstituted Big-Chip Leds on Multi-Layer Interconnects for High-Brightness Lighting
Wafer-Level Packaging Symposium·2014
High-brightness LEDs of big chip size on multi-layer interconnects with optimized thermal dissipation and optical performance
IMAPSource Proceedings·2014
Wafer level LED packaging with optimal light output and thermal dissipation for high-brightness lighting
2014
Wafer level packaging for high-brightness LED lighting with optimized thermal dissipation and optical performance
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)·2014Open Access
Best Practices for Road Weather Management. Version 3.0
2012· 5 cited

Frequent Co-authors

Guilian Gao(12), Laura Mirkarimi(12), Thomas Workman(12), G. G. Fountain(12), Jeremy Theil(11), Cyprian Uzoh(11), Bongsub Lee(10), Dominik Suwito(7), P. Mrozek(5), Rajesh Katkar(5), KM Bang(4), Roseann Alatorre(4), Rey Co(4), Ping Liu(3), Liang Wang(3), Hala Shaba(3), Michael Huynh(2), Grant Villavicencio(2), Eric Tosaya(2), Zhang Ron(2)