Guilian Gao

Engineering · Physical Sciences

15h-index565citations53works1.62yr avg
OpenAlex↗Google Scholar↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

3D IC and TSV technologies(26), Electronic Packaging and Soldering Technologies(24), Additive Manufacturing and 3D Printing Technologies(11), Corrosion Behavior and Inhibition(5), Copper Interconnects and Reliability(4)

Publications53 total

Boundedness of averaging operators on non-doubling manifolds with ends
Journal of Mathematical Inequalities·2025Open Access
Hybrid Bonding Process Technology
2024· 4 cited
High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry
2024· 4 cited
Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration
IMAPSource Proceedings·2024Open Access
Chemistry and Process Considerations for the Removal of Residues for Hybrid Bonding
IMAPSource Proceedings·2024Open Access
Hybrid Bond Interconnect and Advanced Packaging Solutions
IMAPSource Proceedings·2023Open Access
Fine Pitch Die-to-Wafer Hybrid Bonding
2023· 10 cited
The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)·2022· 39 cited
Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)·2022· 14 cited
Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)·2022· 18 cited
Die to Wafer Hybrid Bonding and Fine Pitch Considerations
2021· 28 cited
Low Temperature Hybrid Bonding for Die to Wafer Stacking Applications
2021· 15 cited
Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration
2020· 18 cited
Die to Wafer Hybrid Bonding: Multi-Die Stacking with TSV Integration
Wafer-Level Packaging Symposium·2020
Die to Wafer Stacking with Low Temperature Hybrid Bonding
2020· 39 cited
Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study
2019· 28 cited
Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study
Wafer-Level Packaging Symposium·2019
Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect
2019· 37 cited
Recent Developments in Fine Pitch Wafer-to-Wafer Hybrid Bonding with Copper Interconnect
Wafer-Level Packaging Symposium·2019
Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
2019· 62 cited
page 1 of 3Next →

Frequent Co-authors

Laura Mirkarimi(27), Bongsub Lee(27), G. G. Fountain(24), Cyprian Uzoh(24), Jeremy Theil(18), Thomas Workman(16), Dominik Suwito(12), Gabe Guevara(11), Sitaram Arkalgud(11), Rajesh Katkar(9), P. Mrozek(8), KM Bang(8), Scott McGrath(8), Liang Wang(6), Hong Shen(6), Charles Woychik(5), Mark Ricketts(4), Oliver Zhao(4), Liang Wang(4), Ping Liu(3)