Michael Guillorn

IBM (United States) — United States

Engineering · Physical Sciences

41h-index5.2kcitations135works2.52yr avg
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Research Topics

Semiconductor materials and devices(44), Carbon Nanotubes in Composites(41), Advancements in Semiconductor Devices and Circuit Design(36), Graphene research and applications(19), Diamond and Carbon-based Materials Research(18)

Publications135 total

Power-Limited Inference Performance Optimization Using a Software-Assisted Peak Current Regulation Scheme in a 5-nm AI SoC
IEEE Journal of Solid-State Circuits·2024
14.1 A Software-Assisted Peak Current Regulation Scheme to Improve Power-Limited Inference Performance in a 5nm AI SoC
2024· 5 cited
Vertically aligned nanostructure scanning probe microscope tips
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)·2023Open Access
A 7-nm Four-Core Mixed-Precision AI Chip With 26.2-TFLOPS Hybrid-FP8 Training, 104.9-TOPS INT4 Inference, and Workload-Aware Throttling
IEEE Journal of Solid-State Circuits·2021· 27 cited
RaPiD: AI Accelerator for Ultra-low Precision Training and Inference
2021· 72 cited
9.1 A 7nm 4-Core AI Chip with 25.6TFLOPS Hybrid FP8 Training, 102.4TOPS INT4 Inference and Workload-Aware Throttling
2021· 100 cited
Efficient AI System Design With Cross-Layer Approximate Computing
Proceedings of the IEEE·2020· 63 cited
An Interdisciplinary Approach For Problem Solving In A Robotics Application
2020Open Access
A 3.0 TFLOPS 0.62V Scalable Processor Core for High Compute Utilization AI Training and Inference
2020· 39 cited
Lithography, Etch, and Silicon Process Technology
2020
A Scalable Multi-TeraOPS Core for AI Training and Inference
IEEE Solid-State Circuits Letters·2018· 36 cited
Across the Stack Opportunities for Deep Learning Acceleration
Proceedings of the International Symposium on Low Power Electronics and Design·2018· 1 cited
A Scalable Multi- TeraOPS Deep Learning Processor Core for AI Trainina and Inference
2018· 99 cited
Cellular Interfacing with Arrays of Vertically Aligned Carbon Nanofibers and Nanofiber-Templated Materials
2017
Cellular Interfacing with Arrays of Vertically Aligned Carbon Nanofibers and Nanofiber-Templated Materials
2017
Effects of ultraviolet and vacuum ultraviolet synchrotron radiation on organic underlayers to modulate line-edge roughness of fine-pitch poly-silicon patterns
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2017· 4 cited
Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm<sup>2</sup>
2017· 17 cited
Materials characterization for process integration of multi-channel gate all around (GAA) devices
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE·2017· 4 cited
Directed self-assembly patterning for forming fin field effect transistors
SPIE Newsroom·2016· 1 cited
Nanobeam Diffraction and Geometric Phase Analysis for Strain Measurements in Si/SiGe Nanosheet Structures
Microscopy and Microanalysis·2016· 3 citedOpen Access
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Frequent Co-authors

Michael L. Simpson(27), V. I. Merkulov(25), D. H. Lowndes(25), Anatoli V. Melechko(22), Timothy E. McKnight(7), D. Klaus(7), L. R. Baylor(7), Dale K. Hensley(6), J. A. Silberman(6), Swagath Venkataramani(6), Nianzheng Cao(6), Bruce Fleischer(6), Silvia Melitta Mueller(6), Jinwook Oh(6), Ching Zhou(6), Chia‐Yu Chen(6), Jungwook Choi(6), Howard Haynie(6), M. Scheuermann(6), Naigang Wang(6)