The University of Tokyo — Japan
Engineering · Physical Sciences
11h-index382citations28works7.72yr avg
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Research Topics
Electronic Packaging and Soldering Technologies(16), 3D IC and TSV technologies(7), Intermetallics and Advanced Alloy Properties(5), Aluminum Alloy Microstructure Properties(4), Advanced Welding Techniques Analysis(4)
Publications28 total
eLife·2025· 9 citedOpen Access
iScience·2024· 14 citedOpen Access
Intermetallics·2013· 60 cited
The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics·2013· 34 cited
Characteristics of Beta/Alpha transformations in high purity tin
2013
Microelectronics Reliability·2010· 51 cited
Materials Science and Engineering B·2010· 37 cited
Transactions of The Japan Institute of Electronics Packaging·2010· 15 citedOpen Access
Trace element distribution in solder joints between Sn-based solders and Cu substrates
Queensland's institutional digital repository (The University of Queensland)·2010
Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints
Queensland's institutional digital repository (The University of Queensland)·2009
The influence of solder composition on the impact strength of lead-free solder BGA joints
Queensland's institutional digital repository (The University of Queensland)·2009
The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates
Queensland's institutional digital repository (The University of Queensland)·2009
Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates
Queensland's institutional digital repository (The University of Queensland)·2009· 3 cited
Sn-Cu鉛フリーはんだとCu基板の界面におけるCu 6 Sn 5 金属間化合物の亀裂の抑制
International Conference on Electronics Packaging·2009
Transactions of The Japan Institute of Electronics Packaging·2009· 46 citedOpen Access
Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces
Queensland's institutional digital repository (The University of Queensland)·2009· 5 cited
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Frequent Co-authors
Kazuhiro Nogita(18), Stuart D. McDonald(14), Hideaki Tsukamoto(12), T. Nishimura(9), J. Read(9), Keith Sweatman(6), C.M. Gourlay(6), Tetsuro Nishimura(5), Guang Zeng(3), Qinfen Gu(3), T. Nishimura(3), Miki Umetani(3), Miho Fujisawa(3), Reiko Okura(3), Takashi Nozoe(3), Hidenori Nakaoka(3), Edo Kussell(3), Yuichi Wakamoto(3), Keith Sweatman(3), A. K. Dahle(2)