László Gál

Budapest University of Technology and Economics — Hungary

Computer Science · Physical Sciences

13h-index588citations87works8.72yr avg
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Research Topics

Fuzzy Logic and Control Systems(30), Neural Networks and Applications(29), Electronic Packaging and Soldering Technologies(18), Additive Manufacturing and 3D Printing Technologies(12), 3D IC and TSV technologies(9)

Publications87 total

Soil Degradation of Sustainable PCB Substrates in Natural and Controlled Environments
2025
Soil Degradation of Sustainable PLA/Flax Substrates and Printed Circuit Board Assemblies
2024· 1 cited
Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests
Sustainable materials and technologies·2024· 25 citedOpen Access
Decomposition study of sustainable biodegradable Printed Circuit Boards
2023· 3 cited
Characterization of fluorinated LNMO materials by X-ray photoelectron spectroscopy (XPS).
SPIRE - Sciences Po Institutional REpository·2023
Sustainable Printed Circuit Board Substrates Based on Flame-Retarded Pla/Flax Composites to Reduce Environmental Load of Electronics: Quality, Reliability, Degradation and Application Tests
SSRN Electronic Journal·2023· 3 citedOpen Access
Thermal and RF Characterization of Novel PLA/Flax Based Biodegradable Printed Circuit Boards
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)·2022· 7 cited
Novel PLA/Flax Based Biodegradable Printed Circuit Boards
2022· 12 cited
Analysing fuzzy logic-based line following model car
Mérnöki és Informatikai Megoldások·2020Open Access
Applicability of gage type pressure sensors in vapour phase soldering for process evaluation
2020
Fuzzy logikát alkalmazó vonalkövető autó viselkedésének vizsgálata
Mérnöki és Informatikai Megoldások·2020· 1 citedOpen Access
Reliability Tests on SAC-xMn Solder Alloys
2019· 1 cited
Scaling of Components for Explicit Modelling of Heat Transfer during Vapour Phase Reflow Soldering
2019· 1 cited
Challenges of SMT assembling on biodegradable PCB substrates
2019· 7 cited
Wetting of Different Lead Free Solder Alloys During Vapour Phase Soldering
2019· 1 cited
Electrochemical Migration of SAC305 Solders and Tin Surface Finish in NaCI Environment
2018· 1 cited
Aspects of additive copper deposition on biodegradable and environmentally friendly PCB substrates (PLA, CA, GPTE-DETDA)
2018· 5 cited
Corrosion investigations on lead-free solder alloys in MgCl2 and NaCl solutions
2017· 3 cited
Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution
2017· 2 cited
Mechanical analysis of experimental sugar-based bioepoxy printed circuit boards
2017· 1 cited
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Frequent Co-authors

László T. Kóczy(19), Rita Lovassy(15), Attila Géczy(12), Bálint Medgyes(10), István Hajdu(9), Gábor Harsányi(7), Dániel Rigler(6), Bálint Kovàcs(5), János Botzheim(5), Miklós Ruszinkó(5), Patrik Tamási(4), Balázs Illés(4), Gergely Horváth(3), Pascal Xavier(3), Olivér Krammer(3), Róbert Kovács(3), Daniel Nagy(3), Imre J. Rudas(3), C. Prunty(2), Csaba Farkas(2)