Olivér Krammer

Budapest University of Technology and Economics — Hungary

Engineering · Physical Sciences

18h-index1.2kcitations152works2.22yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(106), 3D IC and TSV technologies(51), Advanced Welding Techniques Analysis(19), Adhesion, Friction, and Surface Interactions(14), Injection Molding Process and Properties(14)

Publications149 total

Effect of Electromigration in Tin-Bismuth and SAC Lead-Free Solder Joints of 0402 and 0201 Chip Resistors
2025
Investigating the Dynamic Bending Behaviour of Biodegradable Printed Circuit Boards
2025
Influence of Fe-nanoparticle doped flux on electromigration effects in SAC305 solder joints
Journal of Materials Research and Technology·2025· 2 citedOpen Access
Investigating the Mechanical Behaviour of Biodegradable Substrates
2025
Low-Temperature Soldering (LTS) in the Electronics Industry: a Brief Review
2025· 2 cited
Mechanical Strength of Aged Solder Joints: Impact of Plasma Treatment
2025
Investigation of Electromigration in Cu-Sn Interfaces under the Condition of High-Current Pulses
2025
Development of Hydrosoluble Substrate with Low Surface Roughness
2025
Risk of transition to lead-free in the space sector: Sn whisker growth in thermal vacuum conditions from submicron Sn layer
Materials & Design·2025· 6 citedOpen Access
Low-Frequency Dielectric Tests of PLA/Flax Sustainable and Degradable PCB Substrates
2024· 1 cited
Addressing the Skills Gap in Microelectronics — Development and Validation of Reactive Response in the Project European Chips Skills Academy
2024
Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates
2024· 1 cited
Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating
2024· 2 cited
Unleashing the Full Potential: Increasing the Bit Configuration Options in Configurable Ring Oscillator PUF
2024
Assessing Temperature Sensitivity and Ring Oscillator Count Impact on Configurable Ring Oscillator PUF Performance
2024· 1 cited
Iron Nanoparticle-Doped Flux: Wetting Characteristics of Flux and SAC305 Solder and Effects on Flux Viscosity
2024· 1 cited
Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes
2024· 1 cited
Modelling the Effect of Laser-Trimming on the Electrical Properties of Thick-film Resistors
2024
Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests
Sustainable materials and technologies·2024· 25 citedOpen Access
Status Report of Training Development in the METIS Project Focusing on Test and Validation
2023· 2 cited
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Frequent Co-authors

Balázs Illés(21), Attila Géczy(14), David Bušek(13), Karel Dušek(13), Tamás Hurtony(7), László Jakab(6), Bálint Medgyes(6), Gábor Harsányi(6), Péter Martinek(6), Tamás Garami(5), Barbara Horváth(4), Agata Skwarek(4), Dániel Straubinger(4), Zsolt Illyefalvi‐Vitéz(4), Attila Bonyár(2), Petr Veselý(2), László Gál(2), Dániel Rigler(2), Benjámin Gyarmati(2), András Szilágyi(2)