Zsolt Illyefalvi‐Vitéz

Budapest University of Technology and Economics — Hungary

Engineering · Physical Sciences

10h-index371citations56works0.02yr avg
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Research Topics

Electronic Packaging and Soldering Technologies(32), 3D IC and TSV technologies(18), Adhesion, Friction, and Surface Interactions(12), Semiconductor Lasers and Optical Devices(8), Laser Material Processing Techniques(7)

Publications56 total

Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven
2019· 2 cited
Evaluation of Cloud-based Open Educational Resources for Teaching Microelectronics
2018· 9 cited
Building a cloud platform for education in microelectronics
2017· 3 cited
Learning factories for open schooling and collaboration on science education
2016
MicroElectronics Cloud Alliance (MECA) — Presentation of a new Erasmus+ project
2016· 2 cited
Global networks on nanotechnology education
2014Open Access
Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
Heat and Mass Transfer·2014· 19 cited
Modeling method of heat transfer during Vapour Phase Soldering based on filmwise condensation theory
International Journal of Heat and Mass Transfer·2013· 30 cited
Evaluation of solder joints formed by different Vapour Phase Soldering systems
2013· 2 cited
Graphene and its potential applications in electronics packaging - A review
2013· 10 cited
Modeling of condensation heating during Vapour Phase Soldering
2013· 2 cited
Characterization of vapour phase soldering process zone with pressure measurements
Soldering and Surface Mount Technology·2013· 20 cited
Pressure measurements in a batch type Vapour Phase Soldering Station
2012
Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering
2012· 3 cited
Process parameter optimization of selective soldering
2012· 8 cited
Pressure sensing: A novel method for characterizing the processing zone in Vapour Phase Soldering systems
2012· 4 cited
Mechanical and structural analysis of thermosonic wire bonds
2012
Soldering profile optimization for vapour phase reflow technology
2011· 15 cited
Defect analysis of ultrasonic al wire bonds on Ni-plated package leads
2011· 1 cited
Optimizing laser soldering of SMD components: From theory to practice
2011· 6 cited
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Frequent Co-authors

Attila Géczy(23), Réka Bátorfi(13), Balázs Illés(10), Olivér Krammer(8), Peter Szoke(6), Bálint Balogh(6), Zsolt Péter(5), Miklós Ruszinkó(5), Radu Bunea(4), J. Pinkola(4), Paul Svasta(4), Slavka Tzanova(3), Endre Tóth(3), Zsolt Baranyay(2), G. Thomas Farmer(2), Gábor Harsányi(2), Péter Martinek(2), Zoltan Olah(2), László Gál(2), Dániel Rigler(2)