Giin-Shan Chen

Hunan University — China

Materials Science · Physical Sciences

13h-index487citations74works1.32yr avg
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Research Topics

Copper Interconnects and Reliability(53), Semiconductor materials and devices(36), Electrodeposition and Electroless Coatings(24), Molecular Junctions and Nanostructures(16), Metal and Thin Film Mechanics(12)

Publications74 total

Electrolessly Deposited Co (0.20 at%)-Modified Cu with Greater Thermal- and Electrical Stress-Induced Reliability than Co
Journal of The Electrochemical Society·2025
3-dimensional atomic structures of the thickening T1-phase precipitates in AlCuLi(Mg) alloys
Materials Characterization·2025· 4 cited
Mechanisms of resistivity minimum for thin cobalt films with enhanced bias-stressing resistance by dilute copper alloying
SSRN Electronic Journal·2025Open Access
The impact of titanium alloying on altering nanomechanical properties and grain structures of sputter-deposited cobalt for electromigration reliability enhancement
Journal of Alloys and Compounds·2024· 3 cited
The feasibility of an ultrathin dual-barrier scheme to inhibit interfacial diffusion and reactions in contact stacks of Co/NiSi/Si
Surfaces and Interfaces·2024· 2 cited
Synergistic enhancement of adhesion and electromigration reliability of cobalt via super-diluted (0.06 at.%) tungsten alloying as next-generation interconnect materials
Microelectronics Reliability·2024· 2 cited
Process optimization of titanium self-aligned silicide formation through evaluation of sheet resistance by design of experiment methodology
Solid-State Electronics·2024· 1 cited
The Encaging of Cobalt Interconnect Lines with an Orderly Amino-Based Sam for Electromigration Mitigation Using an All-Wet Electroless Process
SSRN Electronic Journal·2024Open Access
3-Dimensional Atomic Structures of the Thickening T1-Phase Precipitates in Alculi(Mg) Alloys
SSRN Electronic Journal·2024Open Access
Comparison of Barrier Efficiency for Self-Assembled Monolayers on SiO<sub>2</sub> by Using Decyltrimethoxysilane or 3-Aminopropyltrimethoxysilane Vapor Treatment
ECS Journal of Solid State Science and Technology·2023
Ultrasound assistance in the sensitization and activation of porous Al2O3 supports for improving the hydrogen separation of Pd/Al2O3 composite membranes
International Journal of Hydrogen Energy·2023· 3 cited
Comparison of Cobalt Integration with Various Dielectric Materials under Thermal and Electrical Stress
Coatings·2023· 2 citedOpen Access
Understanding electromigration failure behaviors of narrow cobalt lines and the mechanism of reliability enhancement for extremely dilute alloying of manganese oxide
Journal of Alloys and Compounds·2023· 13 cited
Comparison of Precursors for Self-Assembled Monolayers as Cu Barriers
ECS Journal of Solid State Science and Technology·2023· 2 citedOpen Access
Reinforcement in electromigration reliability of Cu interconnects by alloying of extremely dilute MnO
Journal of Alloys and Compounds·2023
Shifting ultraviolet to visible light of photocatalytic enhancements via Au-nanoparticle decoration of TiO2/WO3 binary coatings
Vacuum·2023· 1 cited
Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the Perspective of Electrical and Reliability Characteristics
Materials·2023· 5 citedOpen Access
Reliability Characteristics of Metal-Insulator-Semiconductor Capacitors with Low-Dielectric-Constant Materials
Molecules·2023· 3 citedOpen Access
Reinforcement in Electromigration Reliability of Cu Interconnects by Alloying of Extremely Dilute Mno
SSRN Electronic Journal·2023Open Access
Superior Electromigration Reliability of Cobalt Via Super-Diluted (0.06 At.%) Tungsten Alloying as Next-Generation Interconnect Materials
SSRN Electronic Journal·2023Open Access
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Frequent Co-authors

Jau-Shiung Fang(34), Yi-Lung Cheng(33), Chih-Yen Lee(9), Sung‐Te Chen(9), Tzu-Ming Yang(6), Chin-Chia Chang(4), Wei-Jie Hung(3), Yen-Chang Pan(3), Chien-Nan Hsiao(3), Wei‐Chun Chen(3), Yen‐Chin Chen(3), Ching‐En Lee(3), Wei-Fan Peng(3), Yiu-Hsiang Chang(2), Hong-Chang Huang(2), Sung-Te Chen(2), Yenying W. Chen(2), Kai-Chieh Kao(2), Chi-Jia Huang(2), Ting-Hsun Su(2)