Sven Van Elshocht

IMEC — Belgium

Engineering · Physical Sciences

42h-index7.1kcitations424works0.02yr avg
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Research Topics

Semiconductor materials and devices(318), Advancements in Semiconductor Devices and Circuit Design(102), Ferroelectric and Negative Capacitance Devices(85), Copper Interconnects and Reliability(81), Electronic and Structural Properties of Oxides(72)

Publications424 total

A combinatorial study of SiGeAsTe thin films for application as an Ovonic threshold switch selector
Thin Solid Films·2022· 15 cited
Pulsed chemical vapor deposition of conformal GeSe for application as an OTS selector
Materials Advances·2021· 4 citedOpen Access
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
2020· 30 cited
Copper-Ruthenium System Study for Advanced Hybrid BEOL-Interconnects Applications
Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials·2019
Detection and mitigation of furnace anneal induced distortions at the wafer edge
2019· 1 cited
Structural and Magnetic Properties of Mn<sub>3</sub>Ge Grown on a Thin Polycrystalline MgO Seed Layer
physica status solidi (RRL) - Rapid Research Letters·2019· 2 cited
High-performance (&lt;tex&gt;$\text{EOT} &amp;lt; 0.4\text{nm}$&lt;/tex&gt;, Jg∼10<sup>−7</sup> A/cm<sup>2</sup>) ALD-deposited Ru\SrTiO&lt;inf&gt;3&lt;/inf&gt; stack for next generations DRAM pillar capacitor
2018· 10 cited
Synthetic-Ferromagnet Pinning Layers Enabling Top-Pinned Magnetic Tunnel Junctions for High-Density Embedded Magnetic Random-Access Memory
Physical Review Applied·2018· 26 cited
Diffusion‐Mediated Growth and Size‐Dependent Nanoparticle Reactivity during Ruthenium Atomic Layer Deposition on Dielectric Substrates
Advanced Materials Interfaces·2018· 71 citedOpen Access
Cu-Resistivity and Intrinsic EM-Reliability Study in Ta/Cu, Co/Cu and Ru/Cu Systems for Advanced BEOL Cu-Interconnections
Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials·2018
Characterization by GISAXS and Electrochemical Impedance Spectroscopy of porous oxide films
2018
Top-Pinned STT-MRAM Devices With High Thermal Stability Hybrid Free Layers for High-Density Memory Applications
IEEE Transactions on Magnetics·2018· 12 cited
Sub-100 nm<sup>2</sup> Cobalt Interconnects
IEEE Electron Device Letters·2018· 82 cited
Top-pinned STT-MRAM devices with high thermal stability hybrid freelayers for high densitymemory applications
2018 IEEE International Magnetics Conference (INTERMAG)·2018· 1 cited
Microwave Characterization of Ba-Substituted PZT and ZnO Thin Films
IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control·2018· 10 citedOpen Access
Solving the BEOL compatibility challenge of top-pinned magnetic tunnel junction stacks
2017· 29 cited
Impact of Ta and W-based spacers in double MgO STT-MRAM free layers on perpendicular anisotropy and damping
Applied Physics Letters·2017· 46 cited
Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl) (1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties
Chemistry of Materials·2017· 54 cited
Control of Interlayer Exchange Coupling and Its Impact on Spin–Torque Switching of Hybrid Free Layers With Perpendicular Magnetic Anisotropy
IEEE Transactions on Magnetics·2017· 7 cited
Control of interlayer exchange coupling and its impact on spin-torque switching of hybrid free layers with perpendicular magnetic anisotropy
2017 IEEE International Magnetics Conference (INTERMAG)·2017· 6 cited
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Frequent Co-authors

Annelies Delabie(17), Christoph Adelmann(16), Thierry Conard(15), Stefan De Gendt(14), Marc Heyns(12), Thierry Verbiest(11), André Persoons(11), Matty Caymax(11), Johan Swerts(10), H. Bender(9), Martti Kauranen(8), M. Popovici(8), Geoffrey Pourtois(8), J. A. Kittl(7), Johan Meersschaut(7), Wilfried Vandervorst(7), Alexis Franquet(6), Bert Brijs(6), Thomas J. Katz(5), Marc Meuris(5)