Dominik Metzler

IBM Research - Thomas J. Watson Research Center — United States

Engineering · Physical Sciences

13h-index1.0kcitations32works0.32yr avg
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Research Topics

Semiconductor materials and devices(18), Plasma Diagnostics and Applications(11), Advancements in Photolithography Techniques(9), Diamond and Carbon-based Materials Research(5), Copper Interconnects and Reliability(5)

Publications32 total

Predicting and measuring scummed contact holes
Journal of Micro/Nanopatterning Materials and Metrology·2025
Patterning stack and process co-optimization for <24P high-NA EUV lithography
2025
Predicting and measuring scummed contact holes
2025
New approach of local critical dimension uniformity improvement for via/contact hole etch with direct current superposition
Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena·2024· 1 cited
Abnormal Grain Growth Maps of Wrought Ni-Base Superalloys
˜The œminerals, metals & materials series·2023
Etch and patterning development for 2nm node nanosheet devices
2022· 1 cited
Significance of plasma-photoresist interactions for atomic layer etching processes with extreme ultraviolet photoresist
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2020· 7 cited
High-Z metal-based underlayer patterning for improving EUV stochastics (Conference Presentation)
2020
Exploration of pillar local CDU improvement options for AI applications (Conference Presentation)
2020
Simulation of photoresist defect transfer through subsequent patterning processes
2020
Selective atomic layer etching of HfO2 over silicon by precursor and substrate-dependent selective deposition
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2020· 23 cited
High-Z metal-based underlayer to improve EUV stochastics (Conference Presentation)
2019· 2 cited
Achieving ultrahigh etching selectivity of SiO2 over Si3N4 and Si in atomic layer etching by exploiting chemistry of complex hydrofluorocarbon precursors
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2018· 51 cited
Introduction of pre-etch deposition techniques in EUV patterning
2018· 2 cited
Polymer brush as adhesion promoter for EUV patterning
2018· 1 cited
Investigation of thin oxide layer removal from Si substrates using an SiO<sub>2</sub>atomic layer etching approach: the importance of the reactivity of the substrate
Journal of Physics D Applied Physics·2017· 30 citedOpen Access
Characterizing fluorocarbon assisted atomic layer etching of Si using cyclic Ar/C4F8 and Ar/CHF3 plasma
The Journal of Chemical Physics·2016· 47 citedOpen Access
Simulation of γ′ Precipitation Kinetics in a Commercial Ni-Base Superalloy
JOM·2016· 23 cited
Fluorocarbon based atomic layer etching of Si3N4 and etching selectivity of SiO2 over Si3N4
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2016· 99 citedOpen Access
Effect of the chamber wall on fluorocarbon-assisted atomic layer etching of SiO2 using cyclic Ar/C4F8 plasma
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films·2016· 35 citedOpen Access
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Frequent Co-authors

G. S. Oehrlein(16), Sebastian Engelmann(12), Robert L. Bruce(11), Chen Li(9), Eric Joseph(8), Luciana Meli(4), Nelson Felix(4), Kang-Yi Lin(3), F. Weilnboeck(3), Bhaskar Nagabhirava(3), Phil Friddle(3), John Arnold(3), Anuja De Silva(3), Jennifer Church(3), Indira Seshadri(3), Eric A. Hudson(2), Scott G. Walton(2), Michael G. Fahrmann(2), Rich Wise(2), Yann Mignot(2)