Sourav Das

Islamic Azad University, Tehran — IR

Computer Science · Physical Sciences

12h-index820citations37works0.02yr avg
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Research Topics

Interconnection Networks and Systems(20), 3D IC and TSV technologies(20), Semiconductor materials and devices(8), Advancements in Battery Materials(5), Graphene research and applications(5)

Publications37 total

A Constructive Heuristic Approach in Multi-Objective Container Loading Optimization Problem Using Practical Instances
SSRN Electronic Journal·2023· 1 citedOpen Access
A Comparative CFD Study to Analyze the Performance of NACA 0018 and S1210 Darrieus Wind Turbine Blade
Lecture notes in mechanical engineering·2023· 2 cited
Development and Dimension of Tiny Methane Microflame Jet under Hot Air and Hot Oxygen Co-flow Condition
Lecture notes in mechanical engineering·2023
UEBA with Log Analytics
2022· 5 cited
A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC
IEEE Transactions on Circuits and Systems I Regular Papers·2020· 10 cited
Airmed: Efficient Self-Healing Network of Low-End Devices
arXiv (Cornell University)·2020Open Access
Testing of Prebond Through Silicon Vias
IEEE Design and Test·2020· 3 cited
Impact of Electrostatic Coupling on Monolithic 3D-enabled Network on Chip
ACM Transactions on Design Automation of Electronic Systems·2019· 16 citedOpen Access
A Comparative Study of Pre-bond TSV Test Methodologies
2019· 3 cited
A PVT-Resilient No-Touch DFT Methodology for Prebond TSV Testing
2018· 13 cited
Abetting Planned Obsolescence by Aging 3D Networks-on-Chip
2018· 8 cited
High-Performance and Small-Form Factor Near-Field Inductive Coupling for 3-D NoC
IEEE Transactions on Very Large Scale Integration (VLSI) Systems·2018· 10 cited
Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip
ACM Transactions on Design Automation of Electronic Systems·2018· 38 citedOpen Access
Design Space Exploration of 3D Network-on-Chip
ACM Journal on Emerging Technologies in Computing Systems·2018· 3 citedOpen Access
Analyzing power-thermal-performance trade-offs in a high-performance 3D NoC architecture
Integration·2018· 12 cited
Towards Energy Efficient And Reliable 3D Manycore Chip Enabled By Machine Learning
Research Exchange (Washington State University)·2018Open Access
Energy-efficient and robust 3D NoCs with contactless vertical links (Invited paper)
2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)·2017· 3 cited
Monolithic 3D-Enabled High Performance and Energy Efficient Network-on-Chip
2017· 30 cited
Energy and Area Efficient Near Field Inductive Coupling
2017· 12 cited
VFI-Based Power Management to Enhance the Lifetime of High-Performance 3D NoCs
ACM Transactions on Design Automation of Electronic Systems·2017· 3 cited
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Frequent Co-authors

Partha Pratim Pande(20), Janardhan Rao Doppa(13), Krishnendu Chakrabarty(12), Dae Hyun Kim(4), Srinivasan Gopal(4), Deukhyoun Heo(4), Dongjin Lee(3), Dongjin Lee(3), Sreejit Chakravarty(3), Aaron Gember-Jacobson(2), Chaithan Prakash(2), Junaid Khalid(2), Aditya Akella(2), Fei Su(2), Dipanwita RoyChowdhury(2), Tanumoy Banerjee(2), Nripen Mondal(2), Raajay Viswanathan(1), Robert Grandl(1), Dongjin Lee(1)