Geert Willems

IMEC — Belgium

Engineering · Physical Sciences

13h-index1.6kcitations36works0.02yr avg
OpenAlex↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

Electronic Packaging and Soldering Technologies(16), 3D IC and TSV technologies(8), Ferroelectric and Piezoelectric Materials(5), Computer Graphics and Visualization Techniques(5), Acoustic Wave Resonator Technologies(4)

Publications36 total

Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies
IEEE Transactions on Device and Materials Reliability·2018· 9 cited
Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
2018
Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling
IEEE Transactions on Components Packaging and Manufacturing Technology·2017· 8 cited
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Microelectronics Reliability·2017· 13 citedOpen Access
In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module
2017
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
2016· 3 citedOpen Access
Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
2015· 3 cited
Hidden Head-In-Pillow soldering failures
2014· 3 cited
Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
Ghent University Academic Bibliography (Ghent University)·2014
Whisker evaluations in 3D microbump structures
2014
Reduced 2nd level solder joint life time of low-CTE mold compound packages
Ghent University Academic Bibliography (Ghent University)·2014· 1 citedOpen Access
Material identification in electronics
Ghent University Academic Bibliography (Ghent University)·2014
Modeling the low- and high-frequency impedance of thermal reliefs
Lirias (KU Leuven)·2013· 2 citedOpen Access
Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds
2012 4th Electronic System-Integration Technology Conference·2012· 16 cited
Finite element modeling of solder joint fatigue in four-point bending test
2012· 5 cited
New Visualization Techniques for Cuneiform Texts and Sealings
Akkadica·2011· 34 citedOpen Access
Hough Transform and 3D SURF for Robust Three Dimensional Classification
Lecture notes in computer science·2010· 331 cited
Exemplar-based Action Recognition in Video
2009· 42 cited
Spatio-temporal features for robust content-based video copy detection
2008· 34 cited
The presentation of cultural heritage models in EPOCH
Lirias (KU Leuven)·2008· 10 cited
page 1 of 2Next →

Frequent Co-authors

Bart Vandevelde(14), Luc Van Gool(9), H.E. Maes(7), Dirk J. Wouters(6), Bart Allaert(6), Riet Labie(5), Filip Vanhee(4), Ralph Lauwaert(4), Tinne Tuytelaars(3), Eun Gu Lee(3), Frank Verbiest(3), Dirk Vandepitte(3), Davy Pissoort(3), Lieven Degrendele(3), Johan De Baets(3), Franco Zanon(3), Daniël Pletinckx(3), Hendrik Hameeuw(2), D. Degryse(2), G. Groeseneken(2)