C.M. Chua

ON Semiconductor (United States) — United States

Engineering · Physical Sciences

7h-index229citations33works0.02yr avg
OpenAlex↗Google Scholar↗Lab page↗

Accepting Students?

No reports yet. Know if this professor is taking students?

Research Topics

Integrated Circuits and Semiconductor Failure Analysis(28), Near-Field Optical Microscopy(12), Force Microscopy Techniques and Applications(9), Advanced Surface Polishing Techniques(7), Ion-surface interactions and analysis(5)

Publications33 total

Enabling Volume Electrical Fault Isolation Workflow with Automation to Enhance Throughput and Success Rate
Proceedings - International Symposium for Testing and Failure Analysis·2025
Predicting the Antifungal Activity of Small Organic Compounds on <i>Aspergillus niger</i> Mold using Molecular Dynamics Simulations
The Journal of Physical Chemistry B·2024
Overview of Wafer-level Electrical Failure Analysis Process for Accelerated Yield Engineering
ASM International eBooks·2019
Experimental Demonstration of the Effects of Laser Pulse Duration on SEU and LADA in CMOS Devices
Proceedings - International Symposium for Testing and Failure Analysis·2016· 1 cited
Fault Isolation Using Electrically-Enhanced LADA (EeLADA)
Proceedings - International Symposium for Testing and Failure Analysis·2015· 3 cited
Fault isolation using Electrically-enhanced LADA (EeLADA)
2015· 3 cited
One die logic analysis through the backside
2014
Evolution of Wafer Level Tester-Based Diagnostic System—More Than Just a Dynamic Electrical Fault Isolation Tool
Proceedings - International Symposium for Testing and Failure Analysis·2013· 2 cited
Through silicon in-circuit logic analysis for localizing logic pattern failures
Microelectronics Reliability·2012· 3 cited
Effectiveness of frequency mapping on 28 nm device broken scan chain failures
Review of Scientific Instruments·2012· 7 cited
Characterization of MOS Transistors Using Dynamic Backside Reflectance Modulation Technique
Proceedings - International Symposium for Testing and Failure Analysis·2011
N-channel metal-oxide-semiconductor characterization with static and dynamic backside laser reflectance modulation techniques
Applied Physics Letters·2011· 1 cited
Negative backside thermoreflectance modulation of microscale metal interconnects
Electronics Letters·2011
Backside reflectance modulation of microscale metal interconnects
2011
Tester-Driven Dynamic Laser Stimulation for Hard Functional Failure
Proceedings - International Symposium for Testing and Failure Analysis·2010· 2 cited
Laser Timing Probe with Frequency Mapping for Locating Signal Maxima
Proceedings - International Symposium for Testing and Failure Analysis·2009· 8 cited
Resolution and sensitivity enhancements of scanning optical microscopy techniques for integrated circuit failure analysis
2009· 3 cited
Design considerations for refractive solid immersion lens: Application to subsurface integrated circuit fault localization using laser induced techniques
Review of Scientific Instruments·2009· 12 cited
A Low-Voltage Micropower Asynchronous Multiplier With Shift–Add Multiplication Approach
IEEE Transactions on Circuits and Systems I Regular Papers·2008· 19 citedOpen Access
Effect of Refractive Solid Immersion Lens Parameters on the Enhancement of Laser Induced Fault Localization Techniques
Proceedings - International Symposium for Testing and Failure Analysis·2008· 1 cited
page 1 of 2Next →

Frequent Co-authors

J.C.H. Phang(21), L.S. Koh(18), A.C.T. Quah(9), D.S.H. Chan(6), S. H. Goh(6), S.H. Goh(6), Shuangshuang Tan(5), G.F. You(5), B.L. Yeoh(5), J.K.J. Teo(5), Siew Li Tan(4), Mike Bruce(4), J.M. Chin(3), Colin J. R. Sheppard(3), Larry Ross(3), Y.H. Chan(3), Jeffrey Lam(3), W.P. Chua(3), Jeffrey Lam(3), Kathy Yim(2)