T.B. Dao

Engineering · Physical Sciences

3h-index41citations6works3.02yr avg
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Research Topics

Integrated Circuits and Semiconductor Failure Analysis(4), Semiconductor materials and devices(3), Electrostatic Discharge in Electronics(2), Food composition and properties(1), Advancements in Semiconductor Devices and Circuit Design(1)

Publications6 total

Modification of hydrolyzed sweet potato starch by retrogradation to enhanceslowly digestible starch yield
Food Research·2024· 3 citedOpen Access
<span>Measures to build material environment for children aged 5-6 to discover science at kindergarten schools in Lap Vo district, Dong Thap province</span>
Dong Thap University Journal of Science·2023Open Access
Progress and challenges of tungsten-filled through-silicon via
2010· 12 cited
ULSI circuit design trend, technology road map, and test structures for process-induced damage
2003· 1 cited
Non-destructive prognosis method of oxide degradation: a rapid monitoring of oxide energy band changes caused by semiconductor processing
2002· 2 cited
Controlling plasma charge damage in advanced semiconductor manufacturing. Challenge of small feature size device, large chip size, and large wafer size
IEEE Transactions on Electron Devices·1998· 23 cited

Frequent Co-authors

P. Aum(3), R. Brandshaft(1), D. Brandshaft(1), Dina H. Triyoso(1), Tom Kropewnicki(1), F. Mart́ınez(1), R. Noble(1), Michael C. Hamilton(1), Hong Nga Luong(1), Thanh Tùng Nguyễn(1), H.Q. Duong(1), Tho X. Pham(1), Trung-Duc Nguyen(1), Thu Trang Thi Vu(1), Nguyen Thi Nhu Mai Tran(1), Huyen Cao(1), Thuy Diem Nguyen(1)