Akira Shimada

Toray Industries, Inc. (Japan) — Japan

Materials Science · Physical Sciences

19h-index1.1kcitations88works0.02yr avg
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Research Topics

Synthesis and properties of polymers(13), Analytical Chemistry and Chromatography(10), Inorganic and Organometallic Chemistry(8), Chemical Thermodynamics and Molecular Structure(7), Synthesis and biological activity(6)

Publications88 total

High-Density RDL Fan-Out with L/S $2/2\mu \mathrm{m}$ Dry-Etched Micro Vias for Agile Prototyping/Low-Volume Production and TAT/NRE Cost Modeling
2025
Photosensitive Polyimide for Panel-Level RDL Insulator
2025
Excellent Reliability Organic Thermal Interface Materials for SiC Power Module
2023
Novel Photo-definable Low Dk & Df Polyimide for Advanced Package of High Frequency Application
2023
Low DK & DF and High Reliable Polyimide for Redistribution Layer of Advanced Package
Wafer-Level Packaging Symposium·2023
Low Temperature Curable Low Dk & Df Polyimide for Redistribution Layer
Journal of Photopolymer Science and Technology·2022· 3 citedOpen Access
Negative Photo-Definable Polyimide Dry Films for Fine and High Aspect Ratio Patterning
Journal of Photopolymer Science and Technology·2022· 1 citedOpen Access
Low Temperature Curable Low Dk & Df Polyimide for Antenna in Package
International Symposium on Microelectronics·2021Open Access
Development Of Low Dielectric Loss Polyimides And Fabrication Of Advanced Packagings For 5g ApplicationS
2020· 4 cited
Development of Low Dielectric Loss Polyimides and Fabrication of Advanced Packagings for 5G Applications
Wafer-Level Packaging Symposium·2020
Low Df Polyimide with Photosensitivity for High Frequency Applications
Journal of Photopolymer Science and Technology·2020· 55 citedOpen Access
Low Permittivity and Dielectric Loss Polyimide with Patternability for High Frequency Applications
2020· 20 cited
High Thermal Conductive Adhesive Sheet with Low Dielectric Constant
2019
Extreme Low Interfacial Thermal Resistance Heat Conductive Sheet Design
Transactions of The Japan Institute of Electronics Packaging·2019· 3 citedOpen Access
Low Dispersion Loss Polyimides for High Frequency Applications
2018· 5 cited
Photosensitive Polyimide having low loss tangent for RF application
IMAPSource Proceedings·2018· 6 cited
Intercalation of triethylphosphine oxide bearing a phosphoryl group into Dion–Jacobson-type ion-exchangeable layered perovskites
Dalton Transactions·2014· 9 cited
Single- and Double-Layered Organically Modified Nanosheets by Selective Interlayer Grafting and Exfoliation of Layered Potassium Hexaniobate
Langmuir·2014· 46 cited
High thermal conductive adhesive film for Cu and Al plate adhesion in power eectronics package
2013· 1 cited
Interlayer surface modification of the protonated ion-exchangeable layered perovskite HLaNb<sub>2</sub>O<sub>7</sub>•<i>x</i>H<sub>2</sub>O with organophosphonic acids
Chemistry of Materials·2009· 56 cited
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Frequent Co-authors

Ken Hirotsu(16), Fusao Takusagawa(12), Makoto Fukuyo(6), Hitoshi Araki(6), Masao Tomikawa(6), Masayasu Kurahashi(5), Taiichi Higuchi(5), Seiichi Tahara(4), Yoshiyuki Sugahara(4), Yohei Kiuchi(4), Isamu Nitta(3), Hisashi Ogasawara(3), Masaya Jukei(3), Akio Furusaki(2), Yoriyoshi Yoneyama(2), P. Hubert Mutin(2), Yoshio Sasada(2), Akira KAWASE(2), Kazumi Nakatsu(2), Yasuhiko Hayashi(2)