Haikun Yue

Intel (United States) — United States

Engineering · Physical Sciences

6h-index111citations21works0.02yr avg
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Research Topics

Microwave Engineering and Waveguides(7), Radio Frequency Integrated Circuit Design(5), Silicon Carbide Semiconductor Technologies(4), Antenna Design and Analysis(3), Electromagnetic Compatibility and Noise Suppression(3)

Publications21 total

Embedded RDMA Lite for FPGA Interconnect in Active Electronically Scanned Array RADAR
2024
A D‐band wideband low‐cost array for antenna‐in‐package applications
Microwave and Optical Technology Letters·2023· 1 cited
Nonlinear Thermal Analysis of AlGaN/GaN HEMTs With Temperature-Dependent Parameters
IEEE Transactions on Electron Devices·2021· 8 cited
AD-Band Wideband E-Shaped Patch Loaded by Open Stubs for Antenna in Package (AiP) Application
2020 IEEE MTT-S International Wireless Symposium (IWS)·2020
Design and Fabrication of Patch Antenna Array on Quartz Glass Substrate at 146 GHz
2020· 13 cited
A Wideband Nonlinear Behavioral Model for D-Band Power Amplifiers Including Memory Effects
2020 IEEE MTT-S International Wireless Symposium (IWS)·2020· 2 cited
Design and Measurement of D-Band Bonding-Wire Interconnection on Quartz Glass Substrate
2020· 6 cited
Efficient Transient Thermal Simulation of ICs and Packages With Laguerre-Based Finite-Element Method
IEEE Transactions on Components Packaging and Manufacturing Technology·2019· 28 cited
Study on Average Power Handling Capacity of Graphene Nanoribbon Interconnects
2019· 1 cited
Analytical Thermal Model for Self-Heating Effects in Advanced FinFET Devices
2019· 6 cited
An Angelov Large-Signal FET Model Up To 67 GHz
IEEE Transactions on Electron Devices·2019· 13 cited
Design of W band hairpin filter with IPD technology
2019 IEEE MTT-S International Wireless Symposium (IWS)·2019· 9 cited
A Quasi-Physical Compact Large-Signal Model for 70 nm Process GaAs HEMTs
2019 IEEE MTT-S International Wireless Symposium (IWS)·2019· 2 cited
Design and Optimization of a 130-GHz Wire Bond Interconnection
2019· 5 cited
Thermal Analysis and Optimization of High-Power Planar Schottky Diodes with Different Substrates
2019· 2 cited
A Novel Compensation Technique for Bonding-Wire Interconnection Based on Single-Objective Optimization in Millimeter-Wave Band
2018· 8 cited
Numerical calibration on complex propagation constants of grounded coplanar waveguides
2017· 1 cited
Progress of the RF Negative Ion Source Research at HUST
JACOW·2014· 3 citedOpen Access
Anlysis and Design for Resonance Cavity of a Small-scale Medical Cyclotron
International Conference on Mechanic Automation and Control Engineering·2012
Radiation Response of High Speed CMOS Integrated Circuits
IEEE Transactions on Nuclear Science·1987· 1 cited
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Frequent Co-authors

Yang Tang(15), Min Tang(10), Junfa Mao(8), Huabing Zhu(5), Zhang Wen(5), Boshen Chen(5), Xianjin Deng(4), Zheng Gao(2), Wanli Jiang(2), Peng Gao(2), Kaifeng Liu(2), Yonghao Jia(2), R. Jennings(2), Bo Li(1), Li Zhou(1), Wenyuan Zhang(1), Yan Wang(1), Xianjin Deng(1), Liang Chen(1), Bo Li(1)