F.G. Shi

Hefei University of TechnologyChina

Engineering · Physical Sciences

28h-index2.6kcitations142works2.32yr avg

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Research Topics

Electronic Packaging and Soldering Technologies(24), Copper Interconnects and Reliability(15), Semiconductor materials and devices(13), Force Microscopy Techniques and Applications(13), 3D IC and TSV technologies(13)

Publications142 total

Polish Journal of Environmental Studies·2025Open Access
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 11 cited
Sustainability·2022· 15 citedOpen Access
Journal of Mathematics·2021· 3 citedOpen Access
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Frequent Co-authors

Kikuo Okuyama(7), Bin Zhao(6), Ashot Margaryan(6), H.Y. Tong(4), Ju Hyeon Choi(4), S. Chungpaiboonpatana(4), P. Hudek(4), Ivo W. Rangelow(4), Michael Todd(3), Mikrajuddin(3), C.L. Davidson(3), John Mead Adams(3), H. Susan Zhou(3), Jiro Yota(3), H.K. Kim(2), Qing Jiang(2), David T. Hsu(2), Jiun Pyng You(2), Alfred A. Margaryan(2), Yongzhi He(2)