Hefei University of Technology — China
Engineering · Physical Sciences
28h-index2.6kcitations142works2.32yr avg
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Research Topics
Electronic Packaging and Soldering Technologies(24), Copper Interconnects and Reliability(15), Semiconductor materials and devices(13), Force Microscopy Techniques and Applications(13), 3D IC and TSV technologies(13)
Publications142 total
ArXiv.org·2025Open Access
Food Chemistry X·2025· 1 citedOpen Access
Polish Journal of Environmental Studies·2025Open Access
Journal of Molecular Liquids·2025· 5 cited
Polish Journal of Environmental Studies·2025· 1 citedOpen Access
International Journal of Intelligent Systems·2025· 1 citedOpen Access
Journal of Mathematics·2025· 1 citedOpen Access
IEEE Transactions on Components Packaging and Manufacturing Technology·2024· 11 cited
Environment Development and Sustainability·2024· 2 cited
Journal of Mathematics·2023Open Access
PeerJ Computer Science·2023· 3 citedOpen Access
SSRN Electronic Journal·2023Open Access
Sustainability·2022· 15 citedOpen Access
Sustainability·2022· 4 citedOpen Access
Journal of Mathematics·2021· 3 citedOpen Access
Dynamic Games and Applications·2021· 9 cited
Complexity·2021· 1 citedOpen Access
Journal of Mathematics·2020· 7 citedOpen Access
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Frequent Co-authors
Kikuo Okuyama(7), Bin Zhao(6), Ashot Margaryan(6), H.Y. Tong(4), Ju Hyeon Choi(4), S. Chungpaiboonpatana(4), P. Hudek(4), Ivo W. Rangelow(4), Michael Todd(3), Mikrajuddin(3), C.L. Davidson(3), John Mead Adams(3), H. Susan Zhou(3), Jiro Yota(3), H.K. Kim(2), Qing Jiang(2), David T. Hsu(2), Jiun Pyng You(2), Alfred A. Margaryan(2), Yongzhi He(2)