Yiying Yao

Gansu Agricultural University — China

Engineering · Physical Sciences

11h-index853citations25works2.22yr avg
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Research Topics

Silicon Carbide Semiconductor Technologies(10), Electromagnetic Compatibility and Noise Suppression(8), Semiconductor materials and devices(5), Epoxy Resin Curing Processes(5), Advanced DC-DC Converters(4)

Publications25 total

Advances in etiology, pathophysiology, diagnosis, and management of lymphedema: a comprehensive review
Frontiers in Medicine·2025· 1 citedOpen Access
Chlorophyll a and photosynthetic carbon fixation in a tropical coral reef bay (Sanya Bay) of the northern South China Sea, with special reference to the effects of solar ultraviolet radiation B
Marine Pollution Bulletin·2025
A GNSS-IR Soil Moisture Inversion Method Considering Multi-Factor Influences Under Different Vegetation Covers
Agriculture·2025· 4 citedOpen Access
Remote sensing inversion of nitrogen content in silage maize plants based on feature selection
Frontiers in Plant Science·2025· 5 citedOpen Access
Voltage Dynamic Response Analysis Under the Fault of Distribution Network
2024· 1 cited
Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications
Journal of Microelectronics and Electronic Packaging·2016· 4 cited
A 50 kW SiC Three-Phase AC-DC Converter Design for High Temperature Operation
2015
Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging
IEEE Transactions on Components Packaging and Manufacturing Technology·2015· 125 cited
Thermal Stability of Al₂O₃/Silicone Composites as High-Temperature Encapsulants
VTechWorks (Virginia Tech)·2014· 6 citedOpen Access
Exploration of a switching loop snubber for parasitic ringing suppression
2014· 11 cited
An ultra-fast SiC phase-leg module in modified hybrid packaging structure
2014· 55 cited
Dielectric strength of Al<sub>2</sub>O<sub>3</sub>/silicone composites after high‐temperature aging
Journal of Applied Polymer Science·2014· 5 cited
Effect of Al2O3 fibers on the high-temperature stability of silicone elastomer
Polymer·2014· 53 cited
Development of a 1200 V, 120 A SiC MOSFET module for high-temperature and high-frequency applications
2013· 46 cited
A 1200-V, 60-A SiC MOSFET Multichip Phase-Leg Module for High-Temperature, High-Frequency Applications
IEEE Transactions on Power Electronics·2013· 264 cited
A Novel Hybrid Packaging Structure for High-Temperature SiC Power Modules
IEEE Transactions on Industry Applications·2013· 58 cited
A 1200 V, 60 A SiC MOSFET multi-chip phase-leg module for high-temperature, high-frequency applications
2013· 21 cited
Performance evaluation of SiC power MOSFETs for high-temperature applications
2012· 55 cited
Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging
IEEE Transactions on Components Packaging and Manufacturing Technology·2012· 57 cited
High-Temperature Reliability of Direct-Bond-Copper Substrates with Sealed Edges
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)·2012· 5 cited
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Frequent Co-authors

Dushan Boroyevich(18), Khai D. T. Ngo(15), Zheng Chen(7), Guo‐Quan Lu(7), Paolo Mattavelli(5), Kaushik Rajashekara(4), Wenli Zhang(4), Ruxi Wang(3), Zheng Chen(3), Rolando Burgos(3), Zheng Chen(2), Milisav Danilovic(2), Jixuan Yan(2), Li Jiang(1), S.K.H. Fung(1), H.T. Huang(1), Sheng-Jen Cheng(1), Kaixuan Cheng(1), S.W. Wang(1), Y.P. Wang(1)